Umatshini we-CNC wee-semiconductors:
Ukwenziwa Kwemveliso Echanekileyo Kusembindini Wenguquko YeeChip
Ishishini le-semiconductor lisisiseko sobuchwepheshe banamhlanje. Ukususela kwiifowuni eziphathwayo kunye neelaptops ukuya kwiinkqubo zobukrelekrele bokwenziwa, izithuthi zombane, kunye nezixhobo zonyango eziphambili, phantse akukho nto isebenza namhlanje ngaphandle kweesekethe ezidibeneyo (ii-IC). Eyona nto iphambili kweli shishini kukho imfuno engagungqiyo yokuchaneka okulinganiswe kwii-micrometers kwanakwii-nanometers.
Nangona i-photolithography, i-thin-film deposition, kunye ne-etching ziphambili kwiindaba xa abantu bethetha ngokwenza ii-chip, kukho isixhobo esingaqhelekanga kodwa esibaluleke kakhulu esingasemva kwemifanekiso: i-Computer Numerical Control (CNC). I-High-precision CNC machining ivelisa izinto ezithe tyaba kakhulu, ezizinzileyo kubushushu, nezigqibeleleyo ngokwejiyometri ezenza ukuba izixhobo zokwenza ii-semiconductor zibe nokwenzeka.
Eli nqaku liphonononga isizathu sokuba i-CNC machining isabalulekile kwi-semiconductor ecosystem, apho izinto ezixhomekeke kuyo, izixhobo kunye nokunyamezelana okubandakanyekileyo, uphuhliso lwezixhobo zoomatshini kunye neenkqubo, kunye nemingeni yexesha elizayo njengoko ishishini lisiya ekuvelisweni kwexesha le-angstrom.
Kutheni i-CNC Machining ihlala ibalulekile kwi-semiconductor
izixhoboIzityalo zokwenza ii-semiconductor (ii-fabs) ziqulathe amakhulu ezixhobo zenkqubo, nganye ixabisa ukusuka kwi-10 yezigidi zeerandi ukuya ngaphezulu kwe-400 yezigidi zeerandi (kwiinkqubo ze-ASML ze-High-NA EUV). Phantse zonke ezi zixhobo ziqulathe amakhulu okanye amawaka eendawo ezicwangcisiweyo ngomatshini.Izizathu eziphambili zokuba kutheni i-CNC machining ingenakutshintshwa ngokupheleleyo:
- Ubunzima obukhulu bejometri: Izinto ezininzi zineendlela zokupholisa zangaphakathi ezintsonkothileyo, imingxunya enomlinganiselo ophezulu, iindonga ezibhityileyo, kunye neekhonto ze-3D ezintsonkothileyo ekunzima okanye okungenakwenzeka ukuzenza ngokusebenzisa iindlela zokufaka, zokufaka, okanye zokongeza izinto ezicocekileyo.
- Ukwahluka kwezinto: Izixhobo ze-semiconductor zisebenzisa i-aluminium, intsimbi engatyiwayo (300-series, 316L, 17-4PH), i-titanium, i-copper, i-ceramics (Al₂O₃, AlN, SiC), i-invar, kunye ne-superalloys. I-CNC ingazisingatha zonke.
- Ukunyamezelana okuqinileyo kakhulu: Ukuthamba kwe-1–5 µm kububanzi obuyi-450 mm, indawo yomngxuma ±2 µm, uburhabaxa bomphezulu uRa < 0.1 µm, kunye nokufana okufana < 2 µm zixhaphakile.
- Ukuhambelana kwe-vacuum kunye ne-plasma: Iinxalenye kufuneka ziphile kwi-fluorine okanye i-chlorine plasma enamandla, i-vacuum ephezulu kakhulu (10⁻⁹ mbar), kunye namaqondo obushushu ukusuka kwi-−100 °C ukuya kwi->800 °C ngaphandle kokukhupha igesi okanye ukuvelisa amasuntswana.
- Ukulungiswa nokuhlaziywa: Izinto ezininzi (umz., ukuhlaziywa kwe-electrostatic chuck) ziphinda zicocwe, zifakwe i-coating, kwaye zibuyiselwe kwinkonzo — umjikelo unokwenzeka kuphela ngeenkqubo zokukhupha.
Izinto eziphambili ezenziwe yiCNC Machining
1. Amagumbi okucoca umoya kunye neefreyimu ezinkulu zesakhiwo
Izixhobo zanamhlanje ze-300 mm kunye nezixhobo ze-wafer ezisandula kuvela ze-450 mm ziqulathe amagumbi okucoca i-aluminium okanye e-stainless steel anobunzima beetoni ezininzi kodwa kufuneka agcine udonga lufana kwaye lube tyaba ukuya kuthi ga kwi-10 µm. La magumbi adla ngokwenziwa ngomatshini ukusuka kwi-6061-T6 aluminium forgings okanye iipleyiti ze-316L stainless steel kwii-gantry mills ezinkulu ze-5-axis ezine-hydrostatic guideways.
2. Amanqanaba eWafer kunye namanqanaba eReticle
Intliziyo yezixhobo ze-lithography ze-EUV kunye ne-DUV yinqanaba le-wafer elihambisa ii-wafers ze-silicon ezingama-300 mm phantsi kwe-projection optics kwi-accelerations > 8g ngelixa ligcina ukuchaneka kwendawo ye-nanometer. Ezi zigaba ziindibano ezintsonkothileyo ze-ceramic (i-SiSiC, i-Zerodur, i-ULE glass) okanye iindawo ze-aluminium ezenziwe nge-sub-micron tolerances zize zijikelwe ngesandla okanye zibe yidayimani kwi-geometry yokugqibela.
3. Ii-Electrostatic Chucks (ESC)
Ii-electrostatic chucks zibamba ii-wafers zithe tyaba ngokupheleleyo ngexesha le-lithography, i-etching, kunye ne-deposition. Umphezulu we-dielectric (ngesiqhelo i-Al2O3 okanye i-AlN ceramic etshizwa kwisiseko se-aluminium okanye se-molybdenum) kufuneka ucocwe ngomatshini kwaye upholishwe ukuze ube kumgangatho othe tyaba we-peak-to-valley < 1 µm kumgama we-300 mm. Isiseko ngokwaso sifuna imijelo yokupholisa yangaphakathi eyinkimbinkimbi eyenziwe nge-CNC milling ekhawulezayo okanye i-wire EDM.
4. Ii-Shawerheads kunye neeRingi zoMphetho zoSasazo lweGesi
Izixhobo zokupeyinta kunye nezixhobo zokufaka i-plasma zisebenzisa ii-shawaheads ezinamawaka eemingxuma ezinobukhulu obuchanekileyo nezibekwe kwindawo ethile (ububanzi obuyi-50–500 µm) ukuhambisa iigesi zenkqubo efanayo. Ezi zihlala zenziwe ngomatshini kwi-aluminium ecocekileyo kakhulu, i-silicon, okanye i-quartz, zihlala zisebenzisa amaziko oomatshini be-CNC ane-axis ezininzi kunye nobuchule bokugrumba obuncediswa yi-ultrasonic okanye i-laser.
5. Izixhobo zokukhanya kunye neeNqamlezo
I-EUV lithography isebenza kwi-13.5 nm wavelength kwaye isebenzisa izibuko ezibonisa ukukhanya ze-molybdenum-silicon multilayer. I-substrates zesibuko (ngesiqhelo i-Zerodur okanye i-ULE glass) ziqala zenziwe ngomatshini orhabaxa ngokujika kwedayimani enye okanye ngokugaywa ngokuchanekileyo, emva koko zipolishwe ngokubonakalayo. I-kinematic mounts ezibamba ezi zibuko kufuneka zenziwe ngomatshini we-CNC ukusuka kwi-Invar okanye kwi-Super Invar ukunciphisa ukuphazamiseka kobushushu.
Izinto ezisetyenziswa kwi-semiconductor CNC Machining
1. IiAluminiyam zeAluminiyam
I-6061-T6 isasebenza kakhulu ngenxa yobuchule bayo bokusebenza, amandla ayo afanelekileyo, kunye nexabiso layo eliphantsi. Ukuze kube nokuqina okuphezulu kunye nokwanda okuphantsi kobushushu, kusetyenziswa ii-alloys ze-aluminium ezizimeleyo ezifana ne-Al 6061-RAM2, i-RSA-6061, okanye i-Cearun™ (i-aluminium eqinisiweyo nge-ceramic).
2. Ii-Alloys eziNcinci
I-Invar 36 kunye ne-Super Invar (ene-cobalt eyongeziweyo) zibonelela ngokwandiswa kobushushu < 1 ppm/°C kwaye zibalulekile kwiindawo ze-reticle kunye ne-wafer stage.
3. Iiseramikhi kunye neeGlasi zoBugcisa
- I-silicon carbide efakwe kwi-silicon (i-SiSiC)
- I-silicon carbide ebotshelelwe kwi-reaction-bond (RBSC)
- Iglasi yokwandisa esezantsi kakhulu yeZerodur® (Schott) kunye neULE® (Corning)
- I-aluminium nitride (AlN) kunye ne-alumina (Al2O3) yee-electrostatic chucks
Ezi zinto zibuthathaka zifuna iinkqubo ezikhethekileyo ze-CNC: i-ultrasonic machining, i-ductile-regime grinding, okanye i-laser-assisted machining.
4. Iintsimbi ezicocekileyo kakhulu
I-Molybdenum, i-tungsten, kunye ne-titanium zisetyenziselwa izinto ezivezwe kwi-fluorine plasma. Ezi metals ezirhabaxa zifuna oomatshini be-CNC abaqinileyo nabanamandla aphezulu kunye nezixhobo zedayimani ye-polycrystalline (PCD).
Izinto eziqhelekileyo zeSemiconductor ezenziwe yiCNC Machining
ilungu | Umbandela oqhelekileyo | Iimfuno eziphambili | Imizekelo yokunyamezelana |
|---|---|---|---|
Ii-wafer chucks (ESC) | I-Alumina, AlN | Ukuthe tyaba < 3 µm, Ra < 0.05 µm, ukuvuza kwe-helium < 10⁻⁹ | Indawo yomngxuma we-±2 µm |
Iishawari / Iipleyiti zegesi | I-Anodized Al, i-316L SS | Imingxuma engama-5000–20,000 Ø0.3–1.0 mm, indawo eyi-±5 µm | < Ra 0.4 µm |
Iindonga zegumbi lokucoca umoya | 6061-T6, 5083 Al | I-Welded + eyenziwe ngomatshini, i-helium iqinile ukuvuza | Ukuthe tyaba < 50 µm ngaphezulu kwe-2 m |
Iindibano ze-electrode | OFHC copper, i-molybdenum | Ukuqhuba kwe-RF, iindlela zokupholisa | Indawo yetshaneli ye-±10 µm |
Iindibano ze-Lift pin | I-stainless egqunywe nge-ceramic | Ukumelana nokunxiba, ulawulo lwamasuntswana | Ukugxila < 5 µm |
Iifreyimu zesakhiwo (i-EUV) | I-Invar 36, ii-alloys ze-CTE eziphantsi | Uzinzo lobushushu < 50 ppb/K | Ukuchaneka kwendawo ±15 µm |
Iindandatho zokugxila, iindandatho ezisemaphethelweni | I-silicon, i-quartz, i-SiC | Ukumelana nokukhukuliseka kweplasma | Ukunyamezelana kweprofayili ±10 µm |
Ezi ndawo zinobukhulu obuqala kwiimilimitha ezimbalwa ukuya kwiimitha ezi-2 kwaye ubunzima bazo buqala kwiigram ukuya kwiitoni ezininzi.
Amanqanaba okuChaneka kunye neMetrology
Ukunyamezelana okuqhelekileyo kwimishini yezixhobo ze-semiconductor:
uphawu | Unyamezelo oluqhelekileyo | Indlela yokulinganisa |
|---|---|---|
Ubuthe tyaba (umphezulu we-300 mm) | 0.5–2 µm PV | I-Interferometry (Fizeau, Zygo) |
Ukufana | 1–5µm | Amanqanaba e-elektroniki + i-interferometry |
Indawo yomngxuma (amawaka emingxuma) | ±2–5 µm | Ukulungelelanisa umatshini wokulinganisa (CMM) |
Ekupheleni | Ra 0.025–0.1 µm | I-interferometry yokukhanya okumhlophe |
Indawo yetshaneli yokupholisa | ±10µm | Uvavanyo lwe-CT okanye uvavanyo lwe-ultrasound |
Iivenkile eziphambili ngoku zihlala zifezekisa ukuchaneka koomatshini "kwi-sub-micron" okanye "kwi-100-nanometer" kwizinto ezinobunzima obungamakhulu eekhilogram.
Uphuhliso lweZixhobo zoMatshini ze-CNC zomsebenzi we-Semiconductor
1. Ixesha lee-1990s-2000s
Iifektri ezinkulu ze-gantry (Waldrich Coburg, Parpas, FPT) ezazineesikali zeHeidenhain kunye ne-glass-scale feedback ephezulu. Iibheringi ze-hydrostatic kunye neeshawa zeoyile zazibonelela ngozinzo lobushushu.
2. Iminyaka yoo-2010: Amanqanaba okuHamba ngomoya kunye neMagnetic Levitation
Iinkampani ezifana neAerotech, iPhysik Instrumente (PI), kunye ne-ALIO Industries zazisa izigaba zeemoto ezizii-air-bearing linear motor ezine-<10 nm repeatable. Ezi zaba ngumqolo weziko loomatshini bokuchwetheza ngokuchanekileyo kwisizukulwana sesibini.
3. Imeko yangoku (2020–2025)
- Oomatshini bokujika idayimani beMoore Nanotechnology kunye nePrecitech single-point kwi-EUV mirror substrates
- Iziko le-micromachining le-Kern Microtechnik kunye ne-Yasda zifikelela kwi-100 nm ngokuchanekileyo
- Uthotho lwe-DMG MORI ULTRASONIC lweeseramikhi
- I-Fanuc ROBONANO α-NMiA: isisombululo senkqubo esingu-0.1 nm kunye nesisombululo sokubeka esingu-1 nm
- Iivenkile ezilawulwa bubushushu ezigcinwe kwi-±0.01 °C ezineziseko zokwahlukanisa ukungcangcazela ezisebenzayo
Imingeni kunye nokukhethwa kwezinto
1. Iingxube zeAluminiyam
I-6061-T6 kunye ne-5083 ziindlela zokusebenza ngenxa yokusebenza kakuhle kunye nempendulo ye-anodization. I-anodizing eqinileyo (Uhlobo lwesithathu) idala umaleko we-25–50 µm Al₂O₃ omelana nohlaselo lwe-plasma. Nangona kunjalo, ii-micropores kwi-anodizing zinokubamba amasuntswana — iivenkile zanamhlanje zisebenzisa i-multi-step sealing kunye ne-proprietary coatings (umz., i-Twin Wire Arc Spray Al₂O₃ okanye i-Y₂O₃ plasma spray).
2. Iintsimbi zentsimbi
I-316L ikhethwa ngenxa yokumelana nokugqwala kwi-plasma ze-NF₃ kunye ne-Cl₂. Ukupholisha nge-electropolishing ukuya kwi-Ra < 0.2 µm kuyimfuneko ukunciphisa ukunamathela kwamasuntswana.
3. Iiceramics
I-Alumina (99.8%), i-aluminium nitride, kunye ne-silicon carbide zenziwa ngendlela "eluhlaza" kusetyenziswa izixhobo zedayimani, emva koko zitshiswe. Ukunyamezela emva kokutshiswe kunciphisa nge-18–22%, nto leyo efuna iimodeli zokunciphisa ezintsonkothileyo.
4. Ii-Alloys ze-Low-CTE
I-Invar 36 kunye ne-Super Invar zisetyenziswa kwizigaba ze-lithography ze-EUV kunye ne-DUV apho kufuneka uzinzo lwe-nanometer kwi-10–40 °C yokutshintsha kobushushu.
5. Iintsimbi ezirhabaxa
I-Molybdenum kunye ne-tungsten zenzelwe ii-electrode ezishushu kakhulu. Ezi zinto zirhabaxa kakhulu kwaye zifuna oomatshini abaqinileyo abane-coolant enoxinzelelo oluphezulu (70–100 bar).
Iinkqubo zoMatshini eziBalulekileyo
1. Umatshini we-Aluminiyam ohamba ngesantya esiphezulu (HSM)
Sisantya sepindle esingama-20,000–42,000 rpm, izixhobo zedayimani ze-PCD okanye ze-single-crystal ezilinganisiweyo, ukupholisa nge-mist, kunye ne-look-ahead algorithms zivumela ukugqitywa okufana nesipili (Ra < 4 nm) kwi-pass enye.
2. Ukwenziwa kweDuctile-Regime Machining yeCeramics
Ngokugcina ubunzulu bokusika bungaphantsi komda obalulekileyo (ngesiqhelo < 1 µm), izinto ezibuthathaka zinokucutshungulwa ngendlela ye-ductile kusetyenziswa izixhobo zedayimani ezibukhali kakhulu, zivelise iindawo ezisemgangathweni obonakalayo ngaphandle kokuqhekeka.
3. Inqaku elinye lokuJika kweDayimane (SPDT)
Kubalulekile kwi-aspheric EUV mirror substrates. Oomatshini basebenza kwiindawo ezine-oyile-inkungu okanye i-vacuum ene-sub-nanometer feedback.
6.4 I-Wire EDM kunye ne-Sinker EDM
Isetyenziselwa ukupholisa nzulu kunye neempawu ezintsonkothileyo kwizinto eziqinileyo. Iijenereyitha zanamhlanje zifikelela ekugqityweni komphezulu < Ra 0.1 µm ngokusika okuncinci.
5. Ukwenziwa kweHybrid okongeziweyo + okuThatyathwayo
Ithrendi ekhulayo: I-Invar ye-3D-print okanye iimilo ze-titanium ezikufutshane ne-net, emva koko umatshini wokugqiba kwiqonga elinye (umz., ii-Hermle MPA okanye ii-Lasertec DED hybrids).
Iimfuno ze-CNC ezichanekileyo nezichanekileyo kakhulu
Iindawo ze-semiconductor zihlala zifuna:
- Ukuchaneka kwendawo: ±2–5 µm ngaphezulu kohambo lwe-500–2000 mm
- Ukuphinda-phinda: < 1 µm
- Ukugqitywa komphezulu: Ra 0.025–0.1 µm kwiindawo ezijonge kwiplasma
- Ubuthe tyaba: 1–3 µm ngaphezulu kwe-Ø300–450 mm
- Ukufana/ukuthe nkqo: < 3 µm
- Iziko loomatshini ezine-axis ezi-5 okanye ezi-axis ezi-8 (umz., iYasda, iMakino, iDMG MORI, iKern, iLiechti)
- Iispindle ezithwala umoya okanye ezisebenzisa amanzi zisebenza ngesantya se-20,000–60,000 rpm
- Iinkqubo zokuzinzisa ubushushu zigcina ubushushu bomatshini ngaphakathi kwe-±0.1 °C
- Izixhobo zokuphanda ezisebenza kumatshini kunye nezixhobo zelaser ezinesisombululo se-0.1 µm
- Iziseko zegranite okanye zepolymer-concrete ezine-active vibration isolation
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Ubuchwephesha bokuSebenza obuPhezulu
1. Umatshini osebenza ngesantya esiphezulu (HSM) onezixhobo ezincinci
Iishawa zinokuba nemingxunya eli-15,000 ye-Ø0.5 mm ebotshiweyo ngesantya se-40,000 rpm kunye nee-micro end mills ezingama-0.1 mm. Ukubhoboza nge-peck nge-100 bar through-tool coolant kuthintela ukuwelda kwakhona kweetships.
2. Ultrasonic-Assisted Machining
Kwi-ceramics kunye ne-quartz, ukungcangcazela kwe-ultrasonic okungama-20–40 kHz kunciphisa amandla okusika ngama-30–70%, okuphucula kakhulu ukugqitywa komphezulu kunye nobomi besixhobo.
3. Inqaku elinye lokuJika kweDayimane (SPDT)
Isetyenziselwa iilensi ze-infrared kunye nezinye ii-electrode zekopolo. Ukugqitywa komphezulu ukuya kwi-Ra 3–5 nm kuqhelekile.
4. Ukusila ngaxeshanye kweJiometri ezintsonkothileyo nge-5-Axis
Iitshaneli zokupholisa zangaphakathi ezinobubanzi obuyi-1 mm kunye nomlinganiselo wobuso obuyi-20:1 zenziwa ngomatshini kusetyenziswa izixhobo ezinde ezithambileyo kunye neendlela zezixhobo ze-trochoidal.
5. Iinkqubo zeHybrid Additive-Subtractive
Ezinye izinto ezintsha (umz., ii-shawaheads ezipholileyo eziguquguqukayo) ziprintwe nge-3D kwi-Inconel okanye nge-copper nge-DMLS/LaserCusing, emva koko zigqitywa ngomatshini ofanayo ukuya kwi-±10 µm.
I-Metrology kunye noQinisekiso loMgangatho
Iindawo ze-semiconductor zihlolwa ngokungqongqo kulo naliphi na icandelo:
- I-Zeiss Prismo okanye i-Leitz PMM-C i-ultra-precision CMMs ene-±0.3 µm yokungaqiniseki
- I-Zygo GPI okanye i-4D Technology phase-shifting interferometers ukuze ihlale ithambile
- Ii-interferometers ezikhanyayo ezimhlophe zeBruker kwiindawo zeRa < 50 nm
- Uvavanyo lokuvuza kweHelium mass-spectrometer ukuya kwi-10⁻¹⁰ mbar·L/s
- Uhlalutyo lwegesi eseleyo (RGA) emva kokubhaka kwe-150 °C ukuqinisekisa ukuphuma kwegesi < 10⁻⁹ I-Torr·L/s/cm²
- Ukubalwa kwee-particles nge-liquid particle counter (LPC) okanye i-laser particle scanner emva kokucoca nge-ultrasonic
Ukucoca kunye nokuLungiswa emva kweMishini yokucoca
Ngenxa yokuba amasuntswana angaphezu kwama-30 nm anokubulala i-transistor ye-3 nm, iivenkile ezininzi ezikumgangatho ophezulu zifake amagumbi okucoca e-ISO 5 (Class 100) okanye e-ISO 4 ngqo kufutshane noomatshini bazo bokuchaneka.
Imizekelo ibandakanya:
- I-Bullen Ultrasonics (e-USA)
- Indawo yokucoca igumbi laseTyrolit CNC (eAustria)
- Igumbi lokucoca ngocoselelo lwe-Utsunomiya yeCanon (eJapan)
- Amanzi e-DI anoxinzelelo oluphezulu + ukushukuma okukhulu
- Ukucoca ngamachiza okunezinyathelo ezininzi (SC-1, SC-2, piranha)
- Ukomisa nge-N₂ ecocekileyo kakhulu
- 150–200 °C ukubhaka nge-vacuum
- Iingxowa ezimbini kwiingxowa ezicociweyo ze-N₂
Isifundo seTyala: Ukulungisa ipleyiti yesiseko se-EUV Wafer Stage
Ipleyiti eqhelekileyo ye-EUV wafer ye-450 mm ibonisa ubunzima:
- Izixhobo: I-SiSiC ceramic, 900 × 800 × 100 mm
- Imfuneko yokuba ithambe: < 1 µm PV kuyo yonke indawo
- Iitshaneli zokupholisa ezifakwe ngaphakathi ezili-120, ububanzi obuyi-3 mm, indawo eyi-±15 µm
- Izinto zokufaka ezifakwe imisonto ezingama-600 (ukukhanya kwe-helium ye-M4)
- Umphezulu wokugqibela: ujikelezwe ukuya kwi-Ra < 50 nm
- Ukulungiswa okuluhlaza kwento engenanto ebotshelelwe kwi-reaction-bond
- Ukungena kwe-silicon kunye nonyango lobushushu
- Ukugaywa okurhabaxa kwiziko lokugaya eline-axis ezi-5
- Ukugqiba ukugaya nge-Ductile-regime enobunzulu obuyi-1 µm bokusika
- Ukugqitywa kweMagnetorheological (MRF) yokulungiswa kwefom yokugqibela
- I-Metrology kwi-interferometer ye-aperture ye-Zygo VeriFire MST engama-600 mm
- Ukuleqa isandla okokugqibela ukuba kuyimfuneko
Imingeni njengoko iShishini lisiya kwi-sub-2 nm Nodes
1. Uzinzo lweNqanaba le-Angstrom
Izixhobo zexesha elizayo ze-EUV high-NA ziya kufuna uzinzo lokubeka isiteji kuluhlu lwe-50–100 picometer. Oku kutyhala izinto zoomatshini kwimida yezinto ezisisiseko.
2. 450 mm Utshintsho
Iiwafer ezinkulu zifuna izinto ezinkulu ezenziwe ngomatshini ezinobunono obufanayo—ukwanda kobunzima ngokukhawuleza.
3. Izinto Ezintsha
Izinto ezisekwe kwikhabhoni (i-graphene coatings, i-carbon efana nedayimani), i-metal-matrix composites, kunye nezakhiwo ze-photonic ziya kufuna iindlela ezintsha zoomatshini.
4. Uzinzo
Eli shishini liphantsi koxinzelelo lokunciphisa ukusetyenziswa kwamandla, amanzi kunye neekhemikhali. Iivenkile zoomatshini zisebenzisa i-minimum-quantity lubrication (MQL), i-cryogenic cooling, kunye nokurisayikilisha ii-aluminium chips.
isiphelo
Nangona iindaba ze-semiconductor zigxile kakhulu kwi-lithography wavelength kunye ne-transistor density, inyani kukuba akukho chip ekhokelayo enokwenziwa ngaphandle komkhosi wezinto ezichanekileyo kakhulu eziveliswa yi-CNC machining. Ukusuka kwiigumbi ze-vacuum ezineetoni ezininzi ezithe tyaba ukuya kwi-micron ukuya kwizigaba ze-ceramic wafer ezizinzileyo ukuya kwiiathom ezimbalwa, i-CNC machining isebenza kumda opheleleyo wento enokwenzeka ngoomatshini.
Njengoko ishishini libaleka ukuya kwiimpawu zesikali se-angstrom kunye nee-wafers ezingama-450 mm, iimfuno zomatshini wokuchaneka ziya kukhula ngakumbi. Iivenkile ezinokunikezela ngokuchaneka kwe-sub-micron kwiindawo zesikali semitha, kwizinto ezingaqhelekanga, phantsi kweemeko zegumbi lokucoca, ziya kuhlala zingamaqabane abalulekileyo kwi-ASML, kwi-Applied Materials, kwi-Lam Research, kwi-Tokyo Electron, kunye nabenzi beetships ngokwabo.
Ekugqibeleni, uMthetho kaMoore odumileyo awulobali nje lwefiziksi kunye nekhemistri—ukwaluloyiso lobunjineli boomatshini oluphumeze into enye ecijiswe ngokugqibeleleyo ngexesha.