Mechini ea CNC bakeng sa Li-semiconductor:
Tlhahiso e Nepahetseng e le Motheo oa Phetohelo ea Chip
Indasteri ea semiconductor ke motheo oa theknoloji ea sejoale-joale. Ho tloha ho li-smartphone le lilaptop ho ea ho litsamaiso tsa bohlale ba maiketsetso, likoloi tsa motlakase le lisebelisoa tse tsoetseng pele tsa bongaka, hoo e ka bang ha ho letho le sebetsang kajeno ntle le lipotoloho tse kopantsoeng (ICs). Motheong oa indasteri ena ho na le tlhoko e sa sekisetseng ea ho nepahala ho lekantsoeng ka li-micrometer esita le li-nanometer.
Leha photolithography, ho beoa ha filimi e tšesaane, le ho fata li atile lihloohong tsa litaba ha batho ba bua ka ho etsa li-chip, ho na le sesebelisoa se sa ananeloeng haholo empa se bohlokoa ka ho feletseng se ka morao ho liketsahalo: Ho sebetsa ka Taolo ea Lipalopalo ea Khomphutha (CNC). Ho sebetsa ka CNC ka nepo ho hlahisa likarolo tse bataletseng haholo, tse tsitsitseng mochesong, le tse phethahetseng ka jeometri tse etsang hore lisebelisoa tsa tlhahiso ea semiconductor li khonehe.
Sengoloa sena se hlahloba hore na ke hobane'ng ha ho sebetsa ka mechine ea CNC ho ntse ho le bohlokoa haholo tikolohong ea semiconductor, eo likarolo tsa eona li itšetlehileng ka eona, thepa le mamello e amehang, tsoelo-pele ea lisebelisoa le lits'ebetso tsa mochini, le liphephetso tsa nakong e tlang ha indasteri e ntse e leba tlhahisong ea mehleng ea angstrom.
Hobaneng ha ho Sebetsa ka Mechini ea CNC ho sa Ntse ho le Bohlokoa ho Semiconductor
HelmetsDifeme tsa tlhahiso ya semiconductor (masela) di na le disebediswa tse makgolo tsa tshebetso, e nngwe le e nngwe e bitsa ho tloha ho $10 milione ho isa ho $400 milione (tabeng ya ditsamaiso tsa ASML tsa High-NA EUV). Hoo e ka bang sesebediswa se seng le se seng sena se na le dikarolo tse makgolo kapa tse dikete tse entsweng ka nepo.Mabaka a bohlokoa a hore mochini oa CNC o ke ke oa nkeloa sebaka ka botlalo:
- Ho rarahana ho feteletseng ha jeometri: Likarolo tse ngata li na le likanale tse rarahaneng tsa ho pholisa ka hare, masoba a tekanyo e phahameng, mabota a masesaane, le li-contour tse rarahaneng tsa 3D tse thata kapa tse ke keng tsa khoneha ho li hlahisa ka mekhoa ea ho lahla, ho betla, kapa ea ho eketsa e hloekileng.
- Mefuta-futa ea thepa: Lisebelisoa tsa semiconductor li sebelisa aluminium, tšepe e sa ruseng (300-letoto, 316L, 17-4PH), titanium, koporo, liseramike (Al₂O₃, AlN, SiC), invar, le li-superalloy. CNC e ka sebetsana le tsona kaofela.
- Mamello e tiileng haholo: Ho batalla ha 1–5 µm ho pholletsa le bophara ba 450 mm, boemo ba lesoba ±2 µm, ho ba thata ha bokaholimo Ra < 0.1 µm, le ho bapaloa ha < 2 µm ke lintho tse tloaelehileng.
- Ho lumellana ha vacuum le plasma: Likarolo li lokela ho phela li-plasma tse matla tsa fluorine kapa chlorine, vacuum e phahameng haholo (10⁻⁹ mbar), le mocheso ho tloha ho −100 °C ho isa ho >800 °C ntle le ho ntša khase kapa ho hlahisa likaroloana.
- Tokiso le Ntlafatso: Likarolo tse ngata (mohlala, ntlafatso ea chuck ea electrostatic) li sebelisoa ka mechini khafetsa, li pentiloe hape, 'me li khutlisetsoa ts'ebetsong - potoloho e ka khonehang feela ka lits'ebetso tsa ho tlosa.
Likarolo tsa Bohlokoa tse Entsoeng ke CNC Machining
1. Likamore tsa ho Hloekisa le Liforeimi tse Kholo tsa Meaho
Lisebelisoa tsa sejoale-joale tsa 300 mm le tse ntseng li hlaha tsa 450 mm li na le likamore tsa aluminium kapa tsa tšepe e sa hloekang tse ka boima ba lithane tse 'maloa empa li tlameha ho boloka ho tšoana ha lebota le ho ba bataletse ho fihlela ho < 10 µm. Likamore tsena hangata li etsoa ka mechini ho tloha ho li-forging tsa aluminium tsa 6061-T6 kapa lipoleiti tsa tšepe e sa hloekang tsa 316L li-mill tse kholo tsa gantry tsa 5-axis tse nang le litsela tsa hydrostatic guideways.
2. Mekhahlelo ea Wafer le Mekhahlelo ea Reticle
Pelo ea lisebelisoa tsa lithography tsa EUV le DUV ke mohato oa wafer o tsamaisang li-wafer tsa silicon tsa 300 mm tlas'a li-optics tsa projection ka lebelo le phahameng la > 8g ha o ntse o boloka ho nepahala ha boemo ba nanometer. Mehato ena ke likopano tse rarahaneng tsa ceramic (SiSiC, Zerodur, khalase ea ULE) kapa likarolo tsa aluminium tse entsoeng ka mechini ho ea ho li-tolerance tsa sub-micron ebe li fetoloa ka letsoho kapa daemane ho ea ho geometry ea ho qetela.
3. Li-Chuck tsa Electrostatic (ESC)
Li-chuck tsa electrostatic li tšoara li-wafer li bataletse hantle nakong ea lithography, etching le deposition. Bokaholimo ba dielectric (hangata Al2O3 kapa AlN ceramic e fafalitsoeng holim'a aluminium kapa molybdenum base) bo tlameha ho etsoa ka mochini le ho bentšitsoe ho fihlela bo bataletse ho tloha tlhōrōng ho ea phuleng < 1 µm ho pholletsa le 300 mm. Botlaase ka bobona bo hloka likanale tse rarahaneng tsa ho pholisa tsa ka hare tse entsoeng ka CNC milling e potlakileng kapa terata EDM.
4. Li-shawara tsa Kabo ea Khase le Masale a Moeli
Lisebelisoa tsa ho tjhesa le ho betla ka plasma li sebelisa li-shaoara tse nang le masoba a likete a boholo bo nepahetseng le a behiloeng hantle (bophara ba 50–500 µm) ho fana ka likhase tse ts'oanang tsa ts'ebetso. Tsena hangata li etsoa ka aluminium e hloekileng haholo, silicon, kapa quartz, hangata li sebelisa litsi tsa machining tsa CNC tse nang le li-axis tse ngata tse nang le bokhoni ba ho cheka bo thusoang ke ultrasonic kapa laser.
5. Likarolo tsa Optical le Lithapo
Lithography ea EUV e sebetsa ka bolelele ba 13.5 nm 'me e sebelisa liipone tse nang le lera le khanyang la molybdenum-silicon. Li-substrate tsa seipone (hangata khalase ea Zerodur kapa ULE) li qala ka ho etsoa ka mokhoa o sa tobang ka ho reteleha ha taemane ka ntlha e le 'ngoe kapa ho sila ka nepo, ebe li bentšitsoe ka mokhoa o hlakileng. Li-mount tsa kinematic tse tšoereng liipone tsena li tlameha ho etsoa ka mokhoa oa CNC ho tsoa ho Invar kapa Super Invar ho fokotsa ho sotha ha mocheso.
Lisebelisoa tse Sebelisitsoeng ho Semiconductor CNC Machining
1. Litšepe tse kopantsoeng tsa Aluminium
6061-T6 e ntse e le mosebetsi o boima ka lebaka la bokgoni ba yona bo botle ba ho sebetsa, matla a matle, le theko e tlase. Bakeng sa ho tiea ho hoholo le katoloso e tlase ya mocheso, ho sebediswa di-alloy tsa aluminium tse ikgethileng tse kang Al 6061-RAM2, RSA-6061, kapa Cearun™ (aluminium e matlafaditsweng ka ceramic).
2. Li-alloy tse sa Atolosoang ka Tlase
Invar 36 le Super Invar (tse nang le cobalt e ekelitsoeng) li fana ka katoloso ea mocheso < 1 ppm/°C 'me li bohlokoa bakeng sa likarolo tsa reticle le wafer stage.
3. Liserame le Likhalase tsa Tekheniki
- Carbide ea silicon e kenelletsoeng ka silicon (SiSiC)
- Carbide ea silicon e kopantsoeng le karabelo (RBSC)
- Khalase ea Zerodur® (Schott) le ULE® (Corning) e nang le katoloso e tlase haholo
- Aluminium nitride (AlN) le alumina (Al2O3) bakeng sa li-chuck tsa electrostatic
Lisebelisoa tsena tse robehang habonolo li hloka lits'ebetso tse khethehileng tsa CNC: ho sebetsa ka ultrasonic, ho sila ka mokhoa oa ductile, kapa ho sebetsa ka laser.
4. Litšepe tse Hloekileng Haholo
Molybdenum, tungsten, le titanium li sebelisoa bakeng sa likarolo tse pepesehetseng plasma ea fluorine. Litšepe tsena tse hanyetsang li hloka mechine e thata ea CNC, e nang le torque e phahameng le lisebelisoa tsa daemane ea polycrystalline (PCD).
Likarolo tse Tloaelehileng tsa Semiconductor tse Entsoeng ke CNC Machining
Sehlopha | Boitsebiso bo Tlwaelehileng | Litlhoko tsa bohlokoa | Mehlala ea Mamello |
|---|---|---|---|
Li-chuck tsa wafer (ESC) | Alumina, AlN | Ho sephara < 3 µm, Ra < 0.05 µm, ho dutla ha helium < 10⁻⁹ | Boemo ba lesoba la ±2 µm |
Li-shawara / Lipoleiti tsa khase | Anodized Al, 316L SS | Mekoti e 5000–20,000 Ø0.3–1.0 mm, boemo ba ±5 µm | < Ra 0.4 µm |
Mabota a kamore ea vacuum | 6061-T6, 5083 Al | E tjheseditswe + e entsweng ka machining, e thata ho dutla ha helium | Bophara < 50 µm ho feta 2 m |
Likopano tsa li-electrode | Koporo ea OFHC, molybdenum | Ho tsamaisa RF, liteishene tsa ho pholisa | Sebaka sa kanale sa ±10 µm |
Likopano tsa phini ea ho phahamisa | Lesela le sa hloekang le koahetsoeng ka letsopa | Ho hanyetsa ho roala, taolo ea likaroloana | Ho tsepamisa mohopolo < 5 µm |
Liforeimi tsa sebopeho (EUV) | Invar 36, li-alloy tse tlase tsa CTE | Botsitso ba mocheso < 50 ppb/K | Ho nepahala ha sebaka ± 15 µm |
Masale a tsepamisitsoeng maikutlo, masale a mathōko | Silicone, quartz, SiC | Ho hanyetsa khoholeho ea plasma | Mamello ea profil ±10 µm |
Likarolo tsena li fapana ka boholo ho tloha ho limilimithara tse 'maloa ho isa ho tse fetang limithara tse 2 le boima ho tloha ho ligrama ho isa ho lithane tse' maloa.
Maemo a Nepahetseng le Metrology
Mamello e tloaelehileng ho machining ea lisebelisoa tsa semiconductor:
Feature | Mamello e Tloaelehileng | Mokhoa oa ho lekanya |
|---|---|---|
Bophara (bophahamo ba 300 mm) | PV ea 0.5–2 µm | Interferometry (Fizeau, Zygo) |
Ho tšoana | 1-5 µm | Maemo a elektroniki + interferometry |
Sebaka sa masoba (masoba a likete) | ±2–5 µm | Mochini o lekanyang oa Coordinate (CMM) |
Qetellong | Ra 0.025–0.1 µm | Interferometry ea leseli le lesoeu |
Boemo ba kanale e phodileng | ±10µm | Tlhahlobo ea CT kapa ultrasound |
Mabenkele a etellang pele hona joale a atisa ho fihlella ho nepahala ha mechini ha "sub-micron" kapa esita le "100-nanometer" dikarolong tse boima ba dikhilogram tse makgolo.
Tsoelo-pele ea Lisebelisoa tsa Mochini oa CNC bakeng sa Mosebetsi oa Semiconductor
1. Nako ea bo-1990-2000
Lifeme tse khōlō tsa gantry (Waldrich Coburg, Parpas, FPT) tse nang le sekala sa Heidenhain le karabelo ea sekala sa khalase e ngata. Li-bearing tsa hydrostatic le lishaoara tsa oli li ne li fana ka botsitso ba mocheso.
2. Lilemo tsa bo-2010: Mekhahlelo ea ho Bea le ho Lefella ka Matla a Khoheli
Likhamphani tse kang Aerotech, Physik Instrumente (PI), le ALIO Industries li hlahisitse mekhahlelo ea li-engine tse tsamaeang ka moea tse nang le pheteho ea < 10 nm. Tsena e bile mokokotlo oa litsi tsa ho sebetsa ka nepo tsa moloko oa bobeli.
3. Boemo ba Hona Joale (2020–2025)
- Mechini ea Moore Nanotechnology le Precitech ea ho retelehela taemane ea ntlha e le 'ngoe bakeng sa li-substrate tsa seipone tsa EUV
- Litsi tsa Kern Microtechnik le Yasda micromachining li fihlella ho nepahala ha sebopeho sa 100 nm
- Letoto la DMG MORI ULTRASONIC bakeng sa liseramike
- Fanuc ROBONANO α-NMiA: qeto ea lenaneo la 0.1 nm le qeto ea ho beha 1 nm
- Mabenkele a laoloang ke mocheso a tšoaretsoe ho ± 0.01 °C ka metheo e sebetsang ea ho itšehla thajana ea ho thothomela
Liphephetso le Khetho ea Thepa
1. Lisebelisoa tsa Aluminium
6061-T6 le 5083 ke li-workhorse ka lebaka la ho sebetsa hantle haholo le karabelo ea anodization. Anodizing e thata (Mofuta oa III) e etsa lera la 25–50 µm Al₂O₃ le hanelang tlhaselo ea plasma. Leha ho le joalo, li-micropores tse ho anodizing li ka tšoasa likaroloana - mabenkele a sejoale-joale a sebelisa ho tiisa ka mehato e mengata le ho koahela ka mokhoa o ikhethileng (mohlala, Twin Wire Arc Spray Al₂O₃ kapa Y₂O₃ plasma spray).
2. Litšepe Tse Hloekileng
316L e kgethilwe bakeng sa ho hanyetsa mafome kgahlanong le plasma ya NF₃ le Cl₂. Ho hlwekisa ka motlakase ho Ra < 0.2 µm ho a hlokahala ho fokotsa ho kgomarela ha dikarolwana.
3. Letsopa
Alumina (99.8%), aluminium nitride, le silicon carbide di etswa ka mochini boemong ba "botala" ho sebediswa disebediswa tsa taemane, ebe di a sintered. Mamello kamora ho sintered e fokotseha ka 18-22%, e leng se hlokang mehlala e rarahaneng ya puseletso ya ho sintered.
4. Li-Alloys tse Tlase tsa CTE
Invar 36 le Super Invar li sebelisoa mekhahlelong ea lithography ea EUV le DUV moo botsitso ba nanometer bo hlokahalang ho pholletsa le liphetoho tsa mocheso oa 10–40 °C.
5. Litšepe tse halefisang
Molybdenum le tungsten li etsoa bakeng sa li-electrode tsa mocheso o phahameng. Lisebelisoa tsena lia khorofoha haholo 'me li hloka mechine e thata e nang le sehatsetsi se nang le khatello e phahameng (li-bar tse 70–100).
Mekhoa ea Bohlokoa ea Machining
1. Mechini e Potlakileng (HSM) ea Aluminium
Slebelo la pindle la 20,000–42,000 rpm, lisebelisoa tsa daemane tsa PCD kapa tsa kristale e le 'ngoe tse leka-lekaneng, ho pholisa ka moholi, le li-algorithms tsa ho sheba pele li lumella ho qeta ho tšoana le seipone (Ra < 4 nm) ka ho pasa hanngoe.
2. Mokhoa oa ho Sebetsa ka Mechini oa Li-ceramics
Ka ho boloka botebo ba sehiloeng bo le ka tlase ho moeli oa bohlokoa (hangata < 1 µm), thepa e robehang habonolo e ka etsoa ka mochini ka mokhoa o ductile ho sebelisoa lisebelisoa tsa taemane tse bohale haholo, tse hlahisang libaka tsa boleng bo holimo ntle le ho petsoha.
3. Ho Phetla ha Taemane ea Ntlha e le 'Ngoe (SPDT)
E bohlokwa bakeng sa di-substrate tsa seipone tsa EUV tse nang le aspheric. Mechini e sebetsa dibakeng tse nang le oli-moholi kapa vacuum tse nang le karabelo ya sub-nanometer.
6.4 EDM ea terata le EDM ea Sinker
E sebelisoa bakeng sa likanale tse tebileng tsa ho pholisa le likarolo tse rarahaneng ka har'a thepa e thatafetseng. Lijenereithara tsa sejoale-joale li fihlela liphetho tsa bokaholimo < Ra 0.1 µm ka ho khaola hanngoe feela.
5. Tlhahiso ea Motsoako o Kopantsoeng o Ekelitsoeng + o Ntšang
Mokhoa o hlahellang: Libopeho tsa Invar tsa khatiso ea 3D kapa titanium tse haufi le nete, ebe mochini o qetang sethaleng se le seng (mohlala, Hermle MPA kapa Lasertec DED hybrids).
Litlhoko tsa CNC tse Nepahetseng le tse Nepahetseng ka ho Fetisisa
Likarolo tsa semiconductor li hloka khafetsa:
- Ho nepahala ha sebaka: ±2–5 µm ho feta leeto la 500–2000 mm
- Ho pheta-pheta: < 1 µm
- Qetello ea bokaholimo: Ra 0.025–0.1 µm holim'a libaka tse shebaneng le plasma
- Bophara: 1–3 µm ho feta Ø300–450 mm
- Ho tšoana/ho ema ka ho lekana: < 3 µm
- Litsi tsa mechini tsa axis tse 5 kapa esita le tse 8 (mohlala, Yasda, Makino, DMG MORI, Kern, Liechti)
- Li-spindle tse nang le moea o kenang ka metsi kapa tse nang le moea tse mathang ka lebelo la 20,000–60,000 rpm
- Mekhoa ea ho tsitsisa mocheso e boloka mocheso oa mochini o le ka hare ho ± 0.1 °C
- Lisebelisoa tsa ho hlahloba ka mochini le lisebelisoa tsa laser tse nang le qeto ea 0.1 µm
- Metheo ea granite kapa ea polymer-koncrete e nang le karohano e sebetsang ea ho thothomela
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Mekhoa e tsoetseng pele ea ho sebetsa
1. Mechini e Potlakileng (HSM) ka Lisebelisoa tse Nyenyane
Lihlooho tsa shaoara li ka 'na tsa ba le masoba a 15,000 a Ø0.5 mm a chekiloeng ka lebelo la 40,000 rpm ka li-mill tsa 0.1 mm tse nyenyane tsa ho qetela. Ho cheka ka peck ka sesebelisoa se pholileng sa bar tse 100 ho thibela ho tjheseletsa hape ha chip.
2. Ultrasonic-Assisted Machining
Bakeng sa liseramike le quartz, ho thothomela ha ultrasonic ha 20-40 kHz ho fokotsa matla a ho seha ka 30-70%, e leng se ntlafatsang haholo qetello ea bokaholimo le bophelo ba sesebelisoa.
3. Ho Phetla ha Taemane ea Ntlha e le 'Ngoe (SPDT)
E sebelisoa bakeng sa lilense tsa infrared le li-electrode tse ling tsa koporo. Liphetho tsa bokaholimo ho fihlela ho Ra 3-5 nm ke tsa kamehla.
4. Ho Siloa ha Li-geometri tse Rarahaneng ka Makhetlo a 5 ka Nako e le 'Ngoe
Dikanale tsa ho phodisa tsa kahare tse nang le bophara ba 1 mm le karolelano ya 20:1 di etswa ka mechini ho sebediswa disebediswa tse fihlang hole le ditsela tsa disebediswa tsa trochoidal.
5. Mekhoa ea ho eketsa le ho tlosa e kopantsoeng
Likarolo tse ling tse ncha (mohlala, li-shawara tse pholileng tse nang le conformal) li hatisitsoe ka 3D ka Inconel kapa koporo ka DMLS/LaserCusing, ebe li phethoa ka mochini o tšoanang ho fihlela ho ±10 µm.
Metrology le Tiisetso ea Boleng
Likarolo tsa semiconductor li hlahlojoa ka thata ka ho fetisisa indastering efe kapa efe:
- Zeiss Prismo kapa Leitz PMM-C CMM tse nepahetseng haholo tse nang le ho se tsitse ha ±0.3 µm
- Li-interferometer tsa Zygo GPI kapa 4D Technology tse fetolang mekhahlelo bakeng sa ho ba bataletse
- Li-interferometer tse khanyang tse tšoeu tsa Bruker bakeng sa libaka tsa Ra < 50 nm
- Teko ea ho lutla ha Helium mass-spectrometer ho fihlela ho 10⁻¹⁰ mbar·L/s
- Tlhahlobo ea Khase e Masala (RGA) kamora ho baka ka 150 °C ho netefatsa ho tsoa ha khase < 10⁻⁹ Torr·L/s/cm²
- Ho bala likaroloana ka sesebelisoa sa ho lekanya likaroloana tsa metsi (LPC) kapa sesebelisoa sa ho hlahloba likaroloana tsa laser kamora ho hloekisoa ka ultrasound
Ho Sebetsa le ho Sebetsa ka Kamoreng ea ho Hloekisa
Kaha dikarolwana tse fetang 30 nm di ka bolaya transistor ya 3 nm, mabenkele a mangata a maemo a hodimo a kentse diphaposi tsa ho hlwekisa tsa ISO 5 (Sehlopha sa 100) kapa ISO 4 ka kotloloho ho potoloha mechini ya tsona e nepahetseng.
Mehlala e kenyeletsa:
- Bullen Ultrasonics (USA)
- Setsi sa ho hlwekisa sa Tyrolit CNC (Austria)
- Kamore ea ho hloekisa ea mochini o nepahetseng oa Canon Utsunomiya (Japane)
- Metsi a khatello e phahameng ea DI + megasonic argying
- Ho hlwekisa lik'hemik'hale ka mehato e mengata (SC-1, SC-2, piranha)
- N₂ e hloekileng haholo e omisang ka moea
- ho baka ka vacuum ka mocheso oa 150–200 °C
- Mekotla e habeli ka mekotleng e hloekisitsoeng ea N₂
Thuto ea Nyeoe: Ho etsa poleiti ea motheo ea EUV Wafer Stage
Letlapa le tloaelehileng la motheo la EUV la wafer la 450 mm le bontša ho rarahana:
- Thepa: SiSiC ceramic, 900 × 800 × 100 mm
- Tlhokahalo ea ho ba sephara: < 1 µm PV holim'a bokaholimo bohle
- Likanale tse 120 tse pholisitsoeng tse kentsoeng, bophara ba 3 mm, boemo ba ±15 µm
- Li-insert tse 600 tse nang le khoele (tse bobebe tsa helium ea M4)
- Bokaholimo ba ho qetela: bo thulane ho fihlela ho Ra < 50 nm
- Ho sebetsa ka botala ha sekheo se kopantsoeng le karabelo
- Ho kenella ha silicon le kalafo ea mocheso
- Ho sila ka thata setsing sa ho sebetsa sa 5-axis
- Ho sila ka mokhoa oa Ductile-regime ka botebo ba sehiloeng ba 1 µm
- Qetello ea Magnetorheological (MRF) bakeng sa tokiso ea ho qetela ea foromo
- Metrology ho Zygo VeriFire MST 600 mm aperture interferometer
- Ho lahlela letsoho la ho qetela haeba ho hlokahala
Liphephetso ha Indasteri e ntse e ea ho Sub-2 nm Nodes
1. Botsitso ba Maemo a Angstrom
Lisebelisoa tsa nakong e tlang tsa EUV high-NA li tla hloka botsitso ba ho beha sethala sebakeng sa 50–100 picometer. Sena se sutumelletsa likarolo tsa mechini ho ea meeling ea motheo ea thepa.
Phetoho ea 2. 450 mm
Li-wafer tse kholo li hloka likarolo tse kholo le ho feta tse entsoeng ka mochini ka ho nepahala ho tšoanang—keketseho e kholo ea bothata.
3. Lisebelisoa tse Ncha
Thepa e thehiloeng khaboneng (likoahelo tsa graphene, khabone e kang taemane), metsoako ea tšepe-matrix, le meaho ea photonic li tla hloka mekhoa e mecha ka ho feletseng ea ho sebetsa.
4. Ts'ebetso
Indasteri e tlas'a khatello ea ho fokotsa tšebeliso ea matla, metsi le lik'hemik'hale. Mabenkele a mechini a sebelisa setlolo se fokolang sa bongata (MQL), ho pholisa ka mokhoa o hlakileng le ho sebelisa hape li-chip tsa aluminium.
fihlela qeto e
Leha taba e hlahelletseng litabeng tsa semiconductor e ntse e le hodima bolelele ba leqhubu la lithography le bongata ba transistor, nnete ke hore ha ho na chip e etellang pele e ka hlahisoang ntle le lebotho la likarolo tse nepahetseng haholo tsa mechini tse hlahisoang ke CNC machining. Ho tloha likamoreng tsa vacuum tsa lithane tse ngata tse bataletseng ho isa ho micron ho isa mekhahlelong ea ceramic wafer e tsitsitseng ho isa ho liathomo tse 'maloa, CNC machining e sebetsa moeling o felletseng oa seo ho ka khonehang ka mechini.
Ha indasteri e ntse e mathela ho ea ho likarolo tsa angstrom-scale le li-wafer tsa 450 mm, litlhoko tsa ho sebetsa ka nepo li tla mpefala feela. Mabenkele a ka fanang ka ho nepahala ha sub-micron likarolong tsa meter, thepa e sa tloaelehang, tlas'a maemo a kamore e hloekileng, a tla lula e le balekane ba bohlokoa ho ASML, Applied Materials, Lam Research, Tokyo Electron, le baetsi ba chip ka bobona.
Qetellong, Molao oa Moore o tummeng ha se pale feela ea fisiks le k'hemistri—e boetse ke tlhōlo ea boenjiniere ba mechini e phethileng karolo e le 'ngoe e entsoeng ka mokhoa o phethahetseng ka nako.