Mashiinka CNC ee Semiconductors-ka:
Soo-saarista Saxda ah ee Wadnaha Kacaanka Chip-ka
Warshadaha semiconductor-ka waa aasaaska tignoolajiyada casriga ah. Laga bilaabo taleefannada casriga ah iyo laptop-yada ilaa nidaamyada sirdoonka macmalka ah, gawaarida korontada, iyo aaladaha caafimaadka ee horumarsan, wax shaqo ah maanta ma jiraan iyada oo aan lahayn wareegyo isku dhafan (ICs). Xudunta warshadahan waxaa ku jira baahi aan la isku halleyn karin oo loogu talagalay saxnaanta lagu cabbiray micrometers iyo xitaa nanometers.
In kasta oo sawir-qaadista, dhigista filimada khafiifka ah, iyo sawir-qaadista ay yihiin kuwa ugu badan ee cinwaannada ugu waaweyn marka dadku ka hadlaan sameynta jajabyada, haddana waxaa jira qalab awood-siiya oo inta badan aan la qaddarin laakiin aad muhiim u ah oo ka dambeeya muuqaalka: Mashiinka Xakamaynta Tirada Kumbuyuutarka (CNC). Mashiinka CNC ee saxnaanta sare leh wuxuu soo saaraa qaybo aad u siman, kuleyl ahaan deggan, iyo qaab-dhismeed ahaan qumman oo ka dhigaya qalabka wax soo saarka semiconductor-ka mid suurtagal ah.
Maqaalkani wuxuu sahaminayaa sababta farsamaynta CNC ay weli lagama maarmaan ugu tahay nidaamka deegaanka semiconductor-ka, qaybaha ay ku tiirsan yihiin, agabka iyo dulqaadka ku lug leh, horumarka qalabka iyo hababka mashiinka, iyo caqabadaha mustaqbalka marka warshaduhu u socdaan wax soo saarka xilligii angstrom.
Sababta Mashiinka CNC uu Muhiim ugu yahay Semiconductor-ka
QalabkaWarshadaha farsamaynta Semiconductor-ka (fab) waxay ka kooban yihiin boqolaal qalab oo wax lagu farsameeyo, mid walbana wuxuu ku kacayaa meel kasta oo u dhaxaysa $10 milyan ilaa in ka badan $400 milyan (marka laga hadlayo nidaamyada ASML ee High-NA EUV). Ku dhawaad mid kasta oo ka mid ah qalabkan wuxuu ka kooban yahay boqolaal ama kumanaan qaybood oo si sax ah loo farsameeyay.Sababaha ugu muhiimsan ee aan si buuxda loo beddeli karin mashiinka CNC:
- Kakanaanta joomatari ee aadka u daran: Qaybo badan ayaa leh kanaallo qaboojin gudaha ah oo adag, godad saami-muuqaal sare leh, derbiyo khafiif ah, iyo qaabab 3D oo adag oo ay adag tahay ama aan macquul ahayn in lagu soo saaro iyadoo la isticmaalayo shubid, been abuur, ama habab lagu daro oo saafi ah.
- Kala duwanaanshaha walxaha: Qalabka Semiconductor-ka wuxuu adeegsadaa aluminium, bir aan miridh lahayn (300-taxane, 316L, 17-4PH), titanium, naxaas, dhoobo (Al₂O₃, AlN, SiC), invar, iyo superalloys. CNC way qaban kartaa dhammaantood.
- Dulqaad aad u adag: Fidsanaan 1–5 µm oo dhexroorkeedu yahay 450 mm, booska godka ±2 µm, qallafsanaanta dusha sare Ra < 0.1 µm, iyo isbarbardhigga < 2 µm ayaa caadi ah.
- Iswaafajinta faakuumka iyo balaasmaha: Qaybuhu waa inay ka badbaadaan balaasmaha fluorine ama chlorine ee gardarrada badan, faakuumka aadka u sarreeya (10⁻⁹ mbar), iyo heerkulka laga bilaabo −100 °C ilaa >800 °C iyada oo aan la isticmaalin gaas ama soo saarid walxo.
- Dayactirka iyo dib-u-habaynta: Qaybo badan (tusaale ahaan, dib-u-habaynta qalabka korontada ku shaqeeya) ayaa si isdaba joog ah loo farsameeyaa, dib loogu dahaadhaa, oo dib loogu celiyaa adeegga - wareeg oo keliya ayaa suurtogal ah iyadoo la adeegsanayo habab kala-goyn ah.
Qaybaha Muhiimka ah ee ay soo saartay CNC Machining
1. Qolalka Faakiyuumka iyo Qaab-dhismeedka Weyn
Qalabka casriga ah ee 300 mm iyo kuwa soo baxaya ee 450 mm waxay ka kooban yihiin qolal faakiyuum ah oo aluminium ama bir aan daxal lahayn kuwaas oo miisaankoodu noqon karo dhowr tan haddana waa inay ilaaliyaan isbarbardhigga derbiga iyo fidsanaanta flange ilaa < 10 µm. Qolalkan waxaa badanaa laga sameeyaa alwaaxyo aluminium ah oo 6061-T6 ah ama saxanno bir ah oo aan daxal lahayn oo 316L ah oo ku yaal mashiinno waaweyn oo 5-dhidib leh oo leh hageyaal hydrostatic ah.
2. Marxaladaha Wafer iyo Marxaladaha Reticle
Wadnaha qalabka lithography-ga EUV iyo DUV waa marxaladda wafer-ka ee dhaqaajisa 300 mm wafers silicon ah oo hoos yimaada muraayadaha saadaasha marka la dardargelinayo > 8g iyadoo la ilaalinayo saxnaanta booska heerka nanometer-ka. Marxaladahani waa isku-dhafka adag ee dhoobada (SiSiC, Zeduror, ULE galaas) ama qaybaha aluminiumka oo lagu farsameeyo dulqaad yar oo micron ah ka dibna gacanta lagu dhejiyo ama dheeman loo rogo joomatari kama dambaysta ah.
3. Chucks Elektrostatic (ESC)
Qalabka korontada ku shaqeeya waxay si fiican u hayaan buskudka inta lagu jiro lithography, qodista, iyo dhigista. Dusha sare ee dielectric (badanaa Al2O3 ama AlN dhoobada lagu buufiyo saldhig aluminium ama molybdenum) waa in la farsameeyaa oo la safeeyaa si ay u noqoto mid siman oo aan ka badnayn 1 µm oo ku wareegsan 300 mm. Saldhigga laftiisu wuxuu u baahan yahay kanaallo qaboojin gudaha ah oo adag oo lagu farsameeyo mishiinka CNC ee xawaaraha sare leh ama EDM.
4. Madaxyada Qaybinta Gaaska iyo Giraangiraha Geesaha
Qalabka lagu dhejiyo iyo qalabka lagu dhejiyo balaasmaha waxay isticmaalaan madaxyada qubeyska oo leh kumanaan godad cabbirkoodu sax yahay oo meel yaal (dhexroorka 50-500 µm) si ay u keenaan gaasas habaysan oo isku mid ah. Kuwaas waxaa badanaa laga sameeyaa aluminium saafi ah, silicon, ama quartz, badanaana waxay isticmaalaan xarumo badan oo CNC ah oo leh awoodo qodis oo ultrasonic ama laser ah.
5. Qaybaha indhaha iyo rakibaadda
Lithography-ga EUV wuxuu ku shaqeeyaa hirarka 13.5 nm wuxuuna adeegsadaa muraayado lakab badan leh oo molybdenum-silicon ah. Muraayadaha muraayadda (badanaa Zeduror ama galaaska ULE) waxaa marka hore lagu farsameeyaa dheeman hal dhibic ah ama shiidi sax ah, ka dibna si indho-furan ayaa loo nadiifiyaa. Qalabka kinematic-ga ee haya muraayadahan waa in lagu farsameeyaa CNC laga bilaabo Invar ama Super Invar si loo yareeyo qallooca kulaylka.
Qalabka loo Isticmaalo Mashiinka CNC ee Semiconductor-ka
1. Alloys-ka Aluminium-ka
6061-T6 ayaa weli ah qofka ugu shaqada badan sababtoo ah mashiinku aad buu u fiican yahay, xoog wanaagsan, iyo kharash yar. Adkayn sare iyo ballaarinta kulaylka oo hooseysa, waxaa la isticmaalaa dahaarka aluminiumka ee gaarka ah sida Al 6061-RAM2, RSA-6061, ama Cearun™ (aluminiumka dhoobada lagu xoojiyay).
2. Alloys-ka Ballaarinta Hoose
Invar 36 iyo Super Invar (oo lagu daray kobalt) waxay bixiyaan ballaarinta kulaylka < 1 ppm/°C waxayna muhiim u yihiin qaybaha marxaladda reticle iyo wafer.
3. Dhoobada iyo Muraayadaha Farsamada
- Karbohaydraytka silikoon ee silikoon-ku dhex milmay (SiSiC)
- Kaarboohaydraytka silikoon ee ku xidhan falgalka (RBSC)
- Muraayad balaastik ah oo aad u hooseeya oo Zedurod® (Schott) iyo ULE® (Corning) ah
- Nitride Aluminium (AlN) iyo Alumina (Al2O3) oo loogu talagalay qalabka elektarooniga ah
Agabkan jilicsan waxay u baahan yihiin habab gaar ah oo CNC ah: mashiinka ultrasonic, shiididda nidaamka ductile, ama mashiinka laser-ka caawiya.
4. Biraha Nadiifka Sare leh
Molybdenum, tungsten, iyo titanium ayaa loo isticmaalaa qaybaha lagu arko balaasmaha fluorine. Birahan aan la qabsan karin waxay u baahan yihiin mashiinno CNC oo adag, oo leh awood sare iyo qalab dheeman polycrystalline (PCD).
Qaybaha Semiconductor-ka Caadiga ah ee ay sameeyeen CNC Machining
Qeybta | Alaabta caadiga ah | Shuruudaha Muhiimka ah | Tusaalooyinka Dulqaadka |
|---|---|---|---|
Jeexjeexyada Wafer-ka (ESC) | Alumina, AlN | Fidsanaan < 3 µm, Ra < 0.05 µm, daadashada helium < 10⁻⁹ | booska godka ±2 µm |
Madaxyada qubeyska / Saxanka gaaska | Anodized Al, 316L SS | 5000–20,000 godad Ø0.3–1.0 mm, ±5 µm booska | < Ra 0.4 µm |
Darbiyada qolka faakuumka | 6061-T6, 5083 Al | Alxan + mishiin, helium-ka oo aan daadan karin | Fidsanaan < 50 µm in ka badan 2 m |
Qalabka korontada ku shaqeeya | naxaasta OFHC, molybdenum | Gudbinta RF, kanaalada qaboojinta | Goobta kanaalka ±10 µm |
Qalabka biinanka kor u qaada | Dahaarka dhoobada lagu dahaadhay | Xiro iska caabin, xakamaynta walxaha | Isku-xidhnaan < 5 µm |
Qaab-dhismeedka (EUV) | Invar 36, daawaha CTE-ga hooseeya | Xasiloonida kulaylka < 50 ppb/K | Saxnaanta booska ±15 µm |
Giraangiraha diiradda la saarayo, giraangiraha geesaha | Silikoon, quartz, SiC | Iska caabinta nabaad-guurka plasma | Dulqaadka astaanta ±10 µm |
Qaybahani waxay u dhexeeyaan cabbir ahaan dhowr milimitir ilaa in ka badan 2 mitir iyo miisaan ahaan garaam ilaa dhowr tan.
Heerarka Saxda ah iyo METrolojiga
Dulqaadyada caadiga ah ee mishiinka qalabka semiconductor-ka:
feature | Dulqaadka caadiga ah | Habka Cabbiraadda |
|---|---|---|
Fidsanaan (300 mm dusha sare) | 0.5–2 µm PV | Interferometry (Fizeau, Zygo) |
Isbarbar dhig | 1-5 µm | Heerarka elektaroonigga ah + interferometry |
Goobta godka (kumanaan godad ah) | ±2-5µm | Mashiinka cabbiraadda isku-duwaha (CMM) |
Dhulka dhamaystiran | Ra 0.025–0.1 µm | Interferometry-ka iftiinka cad |
Booska kanaalka qaboojinta | ±10µm | Baaritaanka CT-ga ama ultrasound-ka |
Dukaamada hormuudka ah hadda waxay si joogto ah u gaaraan saxnaanta farsamada ee "sub-micron" ama xitaa "100-nanometer" ee qaybaha miisaankoodu yahay boqolaal kiilogaraam.
Horumarka Qalabka Mashiinka CNC ee Shaqada Semiconductor-ka
1. Xilligii 1990-meeyadii–2000-meeyadii
Warshadaha waaweyn ee gantry-ga (Waldrich Coburg, Parpas, FPT) oo leh miisaannada Heidenhain iyo jawaab celinta muraayadda oo aad u badan. Biiriyeyaasha hydrostatic iyo qubeyska saliidda ayaa bixiyay xasillooni kuleyl.
2. Sannadihii 2010-meeyadii: Marxaladaha Hawada-qaadista iyo Kala-soocidda Birlabta
Shirkadaha sida Aerotech, Physik Instrumente (PI), iyo ALIO Industries waxay soo bandhigeen marxalado matoorro toosan oo hawada ku shaqeeya oo leh ku celcelin ka yar 10 nm. Kuwaas waxay noqdeen laf-dhabarta xarumaha farsamaynta saxda ah ee jiilka labaad.
3. Xaaladda hadda jirta (2020–2025)
- Moore Nanotechnology iyo Precitech mashiinnada dheemanka hal-dhibic ah ee loogu talagalay muraayadaha EUV
- Xarumaha Microtechnik-ka ee Kern Microtechnik iyo Yasda waxay gaarayaan saxnaanta qaabka 100 nm
- Taxanaha DMG MORI ULTRASONIC ee dhoobada
- Fanuc ROBONANO α-NMiA: Xallinta barnaamijka 0.1 nm iyo xallinta booska 1 nm
- Dukaamada heerkulka lagu xakameeyo oo lagu hayo ±0.01 °C oo leh aasaaska go'doominta gariirka firfircoon
Caqabadaha Agabka iyo Xulashada
1. Aluminium Alloys
6061-T6 iyo 5083 waa farsamooyin shaqo oo ay ugu wacan tahay farsamayn heer sare ah iyo jawaab celin anodization ah. Anodizing-ka adag (Nooca III) wuxuu abuuraa lakab 25–50 µm Al₂O₃ ah oo iska caabiya weerarka balaasmaha. Si kastaba ha ahaatee, daloolada yaryar ee anodizing-ku waxay qaban karaan walxaha - dukaamada casriga ah waxay isticmaalaan shaabad tallaabo badan leh iyo dahaadh gaar ah (tusaale ahaan, Twin Wire Arc Spray Al₂O₃ ama buufin balaasmaha Y₂O₃).
2. Biraha aan lahayn
316L waxaa loo doortaa iska caabbinta daxalka ee ka dhanka ah balaasmaha NF₃ iyo Cl₂. Elektropolishing ilaa Ra < 0.2 µm waa qasab si loo yareeyo isku-xidhka walxaha.
3. Xaraam
Alumina (99.8%), aluminium nitride, iyo silicon carbide waxaa lagu farsameeyaa xaalad "cagaaran" iyadoo la adeegsanayo qalab dheeman ah, ka dibna waa la sifeeyaa. Dulqaadka ka dib sifeynta ayaa hoos u dhacaya 18–22%, taasoo u baahan moodooyinka magdhawga sifeynta ee casriga ah.
4. Alloys-ka CTE-ga ee hooseeya
Invar 36 iyo Super Invar waxaa loo isticmaalaa marxaladaha lithography ee EUV iyo DUV halkaas oo xasilloonida nanometer-ka looga baahan yahay isbeddelka heerkulka 10-40 °C.
5. Biraha aan la adkeyn karin
Molybdenum iyo tungsten waxaa lagu farsameeyaa elektroodhada heerkulka sare leh. Agabkani aad bay u xoqaan waxayna u baahan yihiin mashiinno adag oo leh qaboojiye cadaadis sare leh (70-100 bar).
Geedi socodka Mashiinka Muhiimka ah
1. Makiinadaha Xawaaraha Sare (HSM) ee Aluminiumka
SXawaaraha pindle-ka 20,000–42,000 rpm, qalabka dheemanka PCD ama hal-kiristaal ah oo dheellitiran, qaboojinta ceeryaamo, iyo algorithms-ka ee u oggolaanaya dhammaystirka muraayadda oo kale (Ra < 4 nm) hal mar.
2. Makiinadaha Dhoobada ee Ductile-Rigime
Iyada oo qoto dheer ee jarista laga dhigayo meel ka hooseysa heerka muhiimka ah (badanaa < 1 µm), walxaha jajaban waxaa lagu farsameyn karaa qaab ductile ah iyadoo la adeegsanayo qalab dheeman oo aad u fiiqan, taasoo soo saarta dusha sare ee tayada indhaha iyada oo aan la dillaacin.
3. Meesha Dheemman-Dheeman oo Hal-dhibcood ah (SPDT)
Muhiim u ah muraayadaha EUV ee aspheric-ka ah. Mashiinadu waxay ku shaqeeyaan jawi saliid-ceeryaan ama faakiyuum ah oo leh jawaab celin hoose-nanometer ah.
6.4 Wire EDM iyo Sinker EDM
Waxaa loo isticmaalaa kanaalada qaboojinta qoto dheer iyo sifooyinka adag ee walxaha adag. Matoorada casriga ah waxay gaaraan dhammaystirka dusha sare < Ra 0.1 µm hal jeex oo khafiif ah.
5. Wax-soo-saarka Isku-dhafka ah ee Wax-ku-darka ah + Kala-goynta
Isbeddel soo ifbaxaya: Qaababka Invar ama titanium ee 3D-daabacsan, ka dibna mashiinka dhammaystirka ah ee isla goobta (tusaale ahaan, Hermle MPA ama Lasertec DED hybrids).
Shuruudaha CNC ee Saxnaanta iyo Ultra-Precision
Qaybaha semiconductor-ka ayaa si joogto ah u baahan:
- Saxnaanta booska: ±2–5 µm in ka badan 500–2000 mm safar
- Ku celcelinta: < 1 µm
- Dhammaadka dusha sare: Ra 0.025–0.1 µm oo ku yaal meelaha dusha sare ee u jeeda balaasmaha
- Fidsanaan: 1–3 µm ka badan Ø300–450 mm
- Isbarbardhigga/joogtada ah: < 3 µm
- Xarumaha mashiinka 5-axis ama xitaa 8-axis (tusaale ahaan, Yasda, Makino, DMG MORI, Kern, Liechti)
- Spindles-yada Hydrostatic ama hawo-qaadayaasha ah ee ku shaqeeya 20,000–60,000 rpm
- Nidaamyada xasilinta kulaylka oo heerkulka mashiinka ku haya gudaha ±0.1 °C
- Qalabka baaritaanka mashiinka iyo qalabka laysarka oo leh xallin 0.1 µm
- Saldhigyada Granite ama polymer-concrete oo leh go'doomin firfircoon oo gariir ah
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Farsamooyinka Mashiinka Sare
1. Makiinadaha Xawaaraha Sare (HSM) oo leh Qalab Yar
Madaxyada qubeyska waxay yeelan karaan 15,000 oo godad ah oo Ø0.5 mm ah oo lagu qoday 40,000 rpm oo leh mashiinno yar yar oo 0.1 mm ah. Qoditaanka peck oo leh qaboojiye 100 bar ah ayaa ka hortagaya in chip-ka dib loo alxamo.
2. Mashiinka Caawinta Ultrasonic
Dhoobada iyo quartz-ka, gariirka ultrasonic-ka ee 20-40 kHz wuxuu yareeyaa xoogga jarista 30-70%, taasoo si weyn u hagaajinaysa dhammaystirka dusha sare iyo cimriga qalabka.
3. Meesha Dheemman-Dheeman oo Hal-dhibcood ah (SPDT)
Waxaa loo isticmaalaa muraayadaha infrared-ka iyo qaar ka mid ah elektroodhada naxaasta ah. Dhammaystirka dusha sare ilaa Ra 3–5 nm waa kuwo caadi ah.
4. Shiididda 5-dhidib ee Joomatariyada Isku-dhafan
Kanaallada qaboojinta gudaha oo leh dhexroor 1 mm ah iyo saamiga dhinaca 20:1 ayaa lagu farsameeyaa iyadoo la adeegsanayo qalabyo dhaadheer oo qallafsan iyo marinnada qalabka trochoidal.
5. Geedi socodka Isku-dhafka ah ee Kala-goynta-Isku-dhafka ah
Qaybo cusub oo qaar ka mid ah (tusaale ahaan, madaxyada qubeyska ee la qaboojiyey ee qaabaysan) waxaa lagu daabacay 3D Inconel ama naxaas iyada oo loo marayo DMLS/LaserCusing, ka dibna lagu dhammeeyay mashiinka isla mashiinka ilaa ±10 µm.
Qiimaynta METrology iyo Hubinta Tayada
Qaybaha semiconductor-ka ayaa mara kormeerka ugu adag ee warshad kasta:
- Zeiss Prismo ama Leitz PMM-C CMM-yada aadka u saxsan oo leh ±0.3 µm hubanti la'aan
- Tiknoolajiyada Zygo GPI ama 4D ee kala-goysyada wejiga ee beddelaya fidsanaanta
- Cabbirayaasha iftiinka cad ee Bruker ee dusha sare ee Ra < 50 nm
- Tijaabada daadashada heerka helium mass-spectrometer ilaa 10⁻¹⁰ mbar·L/s
- Falanqaynta Gaaska Haray (RGA) ka dib 150 °C dubista si loo xaqiijiyo in gaaska uu da'o < 10⁻⁹ Torr·L/s/cm²
- Tirinta walxaha iyada oo loo marayo miiska walxaha dareeraha ah (LPC) ama iskaanka walxaha laysarka ka dib nadiifinta ultrasonic-ka
Mashiinka Qolka Nadiifinta iyo Ka-dib-u-habaynta
Maadaama walxaha ka badan 30 nm ay dili karaan transistor 3 nm ah, dukaamo badan oo heer sare ah ayaa si toos ah ugu rakibay ISO 5 (Class 100) ama ISO 4 qolalka nadiifinta ee ku wareegsan mashiinadooda saxda ah.
Tusaale ahaan waxaa ka mid ah:
- Ultrasonic-yada Bullen (USA)
- Xarunta nadiifinta Tyrolit CNC (Austria)
- Qolka nadiifinta saxda ah ee mashiinka lagu nadiifiyo ee Utsunomiya ee Canon (Japan)
- Biyo cadaadis sare leh oo DI ah + kacsanaan megasonic ah
- Nadiifin kiimiko oo tallaabooyin badan leh (SC-1, SC-2, piranha)
- Aad u saafi ah N₂ oo qallajisan
- 150–200°C dubista faakuumka
- Bacaha laba-laaban ee bacaha N₂-la nadiifiyay
Daraasad Kiis: Makiinadaha Saldhigga Wafer-ka ee EUV
Saxanka saldhigga ee caadiga ah ee 450 mm ee wafer EUV wuxuu muujinayaa kakanaanta:
- Qalabka: Dhoobada SiSiC, 900 × 800 × 100 mm
- Shuruudaha fidsanaan: < 1 µm PV oo dhan dusha sare
- 120 kanaal qaboojin oo ku dhex jira, dhexroor 3 mm ah, ±15 µm boos
- 600 oo galool oo dun ah (M4 helium-light)
- Dusha sare ee ugu dambeysa: la jaanqaaday ilaa Ra < 50 nm
- Makiinadda cagaaran ee madhan ee falcelinta ku xidhan
- Ku-soo-galidda silikoon iyo daaweynta kulaylka
- Shiidi adag oo ku taal xarunta mashiinka 5-dhidibka
- Dhammaystirka shiididda nidaamka Ductile-ka oo leh qoto dheer oo 1 µm ah
- Dhammaystirka Magnetorheological (MRF) ee sixitaanka foomka ugu dambeeya
- Qiyaasaha ku saabsan Zygo VeriFire MST 600 mm oo ah dhexdhexaadiyaha daloolka
- Gacan-qabsi kama dambays ah haddii loo baahdo
Caqabadaha Marka Warshadu U Gudubto Nodes-ka Hoose ee 2 nm
1. Xasilloonida Heerka Angstrom
Qalabka mustaqbalka ee EUV-ga sare leh ee NA waxay u baahan doonaan xasillooni booska marxaladda ah ee cabbirka 50-100 picometer. Tani waxay qaybaha farsamada ku riixaysaa xadka agabka aasaasiga ah.
2. 450 mm Kala-guur
Waferada waaweyn waxay u baahan yihiin qaybo ka weyn oo la farsameeyay oo leh isla saxnaantaas - taasoo ah koror xoog leh oo ku yimaada dhibka.
3. Agab Cusub
Alaabada ku salaysan kaarboonka (dahaarka graphene, kaarboon u eg dheeman), isku-darka birta-matrix, iyo qaab-dhismeedka photonic waxay u baahan doonaan qaabab cusub oo gebi ahaanba ah oo machining ah.
4. Waaritaanka
Warshadaha waxaa saaran cadaadis ah inay yareeyaan isticmaalka tamarta, biyaha, iyo kiimikada. Dukaamada wax lagu farsameeyo waxay qaadanayaan saliidaynta tirada ugu yar (MQL), qaboojinta cryogenic, iyo dib u warshadaynta jajabyada aluminiumka.
Ugu Dambeyn
In kasta oo iftiiminta wararka semiconductor-ka ay weli ku jirto mowjadda lithography iyo cufnaanta transistor-ka, xaqiiqadu waxay tahay in aan la soo saari karin jajab hormuud ah oo aan lahayn ciidan ka kooban qaybo farsamo oo aad u sax ah oo ay soo saarto mashiinka CNC. Laga bilaabo qolal faaruq ah oo badan oo siman ilaa micron ilaa marxalado wafer ah oo dhoobada ah oo deggan ilaa dhowr atom, mashiinka CNC wuxuu ka shaqeeyaa xadka ugu sarreeya ee waxa farsamo ahaan suurtagalka ah.
Maadaama warshaduhu ay u tartamayaan sifooyinka cabbirka angstrom iyo wafers 450 mm ah, baahida loo qabo farsamaynta saxda ah ayaa sii xoogaysan doonta. Dukaamada keeni kara saxnaanta sub-micron ee qaybaha cabbirka mitirka, agabka qalaad, xaaladaha qolka nadiifka ah, waxay ahaan doonaan lammaane aan lagama maarmaan u ah ASML, Applied Materials, Lam Research, Tokyo Electron, iyo sameeyayaasha chip-ka laftooda.
Ugu dambeyntii, Sharciga Moore ee caanka ah ma aha oo kaliya sheeko fiisigis iyo kiimikaal ah - sidoo kale waa guul injineerinka farsamada oo hal qayb oo si fiican loo farsameeyay markiiba la fuliyay.