Kukonza Makina a CNC kwa Makampani Osiyanasiyana
Ukadaulo wa makina a CNC umagwiritsidwa ntchito kwambiri m'mafakitale apamwamba kwambiri

Makina a CNC a Semiconductors:
Kupanga Zinthu Molondola Kwambiri Pachimake pa Chip Revolution

Makampani opanga ma semiconductor ndiye maziko a ukadaulo wamakono. Kuyambira mafoni a m'manja ndi ma laputopu mpaka makina opanga nzeru, magalimoto amagetsi, ndi zida zamankhwala zapamwamba, palibe chomwe chimagwira ntchito masiku ano popanda ma integrated circuits (ICs). Pakati pa makampaniwa pali kufunikira kosalekeza kwa kulondola komwe kumayesedwa mu ma micrometers ndi ma nanometers.
 
Ngakhale kuti kujambula zithunzi, kuyika filimu yopyapyala, ndi kusindikiza zinthu kumakhala nkhani zazikulu pamene anthu amalankhula za kupanga ma chip, pali chinthu chomwe nthawi zambiri sichiyamikiridwa koma chofunikira kwambiri chomwe chimapezeka kumbuyo kwa zochitika: Makina Owongolera Numerical (CNC). Makina Opangira CNC olondola kwambiri amapanga zinthu zosalala kwambiri, zokhazikika pa kutentha, komanso zangwiro zomwe zimapangitsa kuti zida zopangira ma semiconductor zikhale zotheka.
 
Nkhaniyi ikufotokoza chifukwa chake makina a CNC akadali ofunikira kwambiri mu semiconductor ecosystem, zomwe zigawo zake zimadalira, zipangizo ndi kulekerera komwe kumakhudzidwa, kusintha kwa zida ndi njira zamakina, komanso mavuto amtsogolo pamene makampaniwa akupita patsogolo kupanga zinthu za nthawi ya angstrom.

Chifukwa Chake Makina a CNC Akukhalabe Ofunika Kwambiri mu Semiconductor

zidaMafakitale opanga zinthu zopangidwa ndi semiconductor (zopangidwa ndi nsalu) ali ndi zida zambirimbiri zogwirira ntchito, chilichonse chimawononga kuyambira $10 miliyoni mpaka $400 miliyoni (potengera makina a ASML a High-NA EUV). Pafupifupi zida zonsezi zili ndi zida mazana kapena zikwizikwi zopangidwa ndi makina olondola.Zifukwa zazikulu zomwe makina a CNC sangasinthidwire kwathunthu:
  • Kuvuta kwambiri kwa geometric: Zigawo zambiri zimakhala ndi njira zovuta zoziziritsira mkati, mabowo apamwamba, makoma opyapyala, ndi mawonekedwe ovuta a 3D omwe ndi ovuta kapena osatheka kupanga pogwiritsa ntchito njira zopangira, zopangira, kapena zowonjezera.
  • Kusiyanasiyana kwa zinthu: Zipangizo za semiconductor zimagwiritsa ntchito aluminiyamu, chitsulo chosapanga dzimbiri (300-series, 316L, 17-4PH), titaniyamu, mkuwa, zoumbaumba (Al₂O₃, AlN, SiC), invar, ndi superalloys. CNC imatha kugwira zonsezi.
  • Kulekerera kolimba kwambiri: Kusalala kwa 1–5 µm m'mimba mwake wa 450 mm, malo a dzenje ±2 µm, kukhwima kwa pamwamba Ra < 0.1 µm, ndi kufanana < 2 µm ndizofala.
  • Kugwirizana kwa vacuum ndi plasma: Zigawo ziyenera kukhalabe ndi fluorine kapena chlorine plasma yoopsa, vacuum yochuluka kwambiri (10⁻⁹ mbar), ndi kutentha kuyambira -100 °C mpaka >800 °C popanda kutulutsa mpweya kapena kupanga tinthu tating'onoting'ono.
  • Kukonza ndi kukonzanso: Zigawo zambiri (monga kukonzanso chuck electrostatic) zimakonzedwanso mobwerezabwereza, kuphimbidwanso, ndikubwezeretsedwanso kuntchito - njira yokhazikika yokha ndi njira zochotsera.
Mwachidule, ngakhale kuti chip yokha imapangidwa ndi njira zowunikira komanso zamakemikolo, makina omwe amapanga chip amapangidwa modabwitsa ndi makina a CNC olondola kwambiri.

Zigawo Zofunika Zopangidwa ndi CNC Machining

1. Zipinda Zotsukira ndi Mafelemu Aakulu Omangidwa
Zipangizo zamakono za 300 mm ndi 450 mm zomwe zikubwerazi zili ndi zipinda zotsukira za aluminiyamu kapena zitsulo zosapanga dzimbiri zomwe zimatha kulemera matani angapo koma ziyenera kukhala ndi makoma ofanana komanso osalala mpaka < 10 µm. Zipinda zimenezi nthawi zambiri zimapangidwa ndi ma aluminium forgings a 6061-T6 kapena mbale za 316L zosapanga dzimbiri pa mill yayikulu ya 5-axis gantry yokhala ndi hydrostatic guideways.
2. Magawo a Wafer ndi Magawo a Reticle
Chida chachikulu cha EUV ndi DUV lithography ndi gawo la wafer lomwe limasuntha ma wafer a silicon a 300 mm pansi pa ma projection optics pa accelerations > 8g pamene likusunga kulondola kwa malo a nanometer. Magawo awa ndi magulu ovuta a ceramic (SiSiC, Zerodur, ULE glass) kapena aluminium opangidwa kuti azigwirizana ndi ma sub-micron tolerances kenako n’kusinthidwa ndi manja kapena diamondi kukhala geometry yomaliza.
3. Ma Electrostatic Chucks (ESC)
Ma chucks a electrostatic amasunga ma wafers osalala bwino panthawi yojambula, kupukuta, ndi kuyika. Malo oyeretsera (nthawi zambiri Al2O3 kapena AlN ceramic yomwe imapopedwa pa aluminiyamu kapena molybdenum base) iyenera kupangidwa ndi makina ndikupukutidwa kuti ikhale yosalala mpaka kufika pa 1 µm kudutsa 300 mm. Maziko enieniwo amafunikira njira zoziziritsira zamkati zomwe zimapangidwa ndi CNC milling yothamanga kwambiri kapena waya EDM.
4. Ma Showerheads ndi Mphete Zogulitsira Gasi
Zipangizo zopangira pulasitiki ndi zoyikapo zinthu zimagwiritsa ntchito mitu ya shawa yokhala ndi mabowo ambirimbiri akuluakulu komanso oyikidwa bwino (m'mimba mwake 50–500 µm) kuti ipereke mpweya wofanana. Izi nthawi zambiri zimapangidwa kuchokera ku aluminiyamu yoyera kwambiri, silicon, kapena quartz, nthawi zambiri pogwiritsa ntchito malo opangira machining a CNC okhala ndi mphamvu zobowola pogwiritsa ntchito ultrasonic kapena laser.
5. Zigawo ndi Zoyikapo Zowala
EUV lithography imagwira ntchito pa kutalika kwa 13.5 nm ndipo imagwiritsa ntchito magalasi owunikira a molybdenum-silicon multilayer. Magalasi ozungulira (nthawi zambiri Zerodur kapena ULE glass) amayamba kupangidwa ndi makina ozungulira pogwiritsa ntchito single-point diamond turning kapena precision grinding, kenako amapukutidwa ndi kuwala. Ma kinematic mounts omwe amasunga magalasi awa ayenera kupangidwa ndi CNC-machined kuchokera ku Invar kapena Super Invar kuti achepetse kusokonezeka kwa kutentha.

Zipangizo Zogwiritsidwa Ntchito mu Semiconductor CNC Machining

1. Ma aluminiyamu a aluminiyamu
6061-T6 ikadali yogwira ntchito chifukwa cha makina ake abwino kwambiri, mphamvu zake zabwino, komanso mtengo wake wotsika. Kuti zinthu zikhale zolimba komanso kutentha kwake kukhale kochepa, zinthu zopangidwa ndi aluminiyamu monga Al 6061-RAM2, RSA-6061, kapena Cearun™ (ceramic-reinforced aluminium) zimagwiritsidwa ntchito.
2. Ma Aloyi Osakula Kwambiri
Invar 36 ndi Super Invar (yokhala ndi cobalt yowonjezera) zimapereka kutentha kwakukulu <1 ppm/°C ndipo ndizofunikira kwambiri pazigawo za reticle ndi wafer stage.
3. Magalasi a Ziwiya ndi Magalasi Aukadaulo
  • Silikoni carbide yolowetsedwa ndi silicon (SiSiC)
  • Kabide ya silikoni yolumikizidwa ndi reaction-bonded (RBSC)
  • Magalasi okulitsa otsika kwambiri a Zerodur® (Schott) ndi ULE® (Corning)
  • Aluminiyamu nitride (AlN) ndi alumina (Al2O3) ya ma chucks a electrostatic

Zipangizo zosweka izi zimafuna njira zapadera za CNC: makina opangira ma ultrasound, kugaya kwa ductile, kapena makina othandizidwa ndi laser.

4. Zitsulo Zoyera Kwambiri

Molybdenum, tungsten, ndi titaniyamu zimagwiritsidwa ntchito pazinthu zomwe zimakhudzidwa ndi plasma ya fluorine. Zitsulo zotsutsa izi zimafuna makina olimba a CNC okhala ndi mphamvu zambiri komanso zida zopangira diamondi ya polycrystalline (PCD).

Zigawo Zapadera za Semiconductor Zopangidwa ndi CNC Machining

chigawo chimodzi
Nkhani Yodziwika
Zofunikira zofunika
Zitsanzo za Kulekerera
Ma chucks a Wafer (ESC)
Alumina, AlN
Kusalala < 3 µm, Ra < 0.05 µm, kutayikira kwa helium < 10⁻⁹
Malo a dzenje la ±2 µm
Mabafa / Ma mbale a gasi
Anodized Al, 316L SS
Mabowo 5000–20,000 Ø0.3–1.0 mm, malo a ±5 µm
< Ra 0.4 µm
Makoma a chipinda chotsukira mpweya
6061-T6, 5083 Al
Yolumikizidwa + yopangidwa ndi makina, yolimba kuti isatuluke ndi helium
Kusalala < 50 µm kupitirira 2 m
Misonkhano ya ma elekitirodi
OFHC mkuwa, molybdenum
Kuwongolera kwa RF, njira zoziziritsira
Malo a njira ya ±10 µm
Misonkhano ya pini yokweza
Zosapanga dzimbiri zophimbidwa ndi ceramic
Kukana kuvala, kuwongolera tinthu tating'onoting'ono
Kukhazikika kwa mtunda < 5 µm
Mafelemu a kapangidwe ka nyumba (EUV)
Invar 36, ma alloys otsika a CTE
Kukhazikika kwa kutentha < 50 ppb/K
Kulondola kwa malo ± 15 µm
Mphete zoyang'ana, mphete za m'mphepete
Silikoni, khwatsi, SiC
Kukana kukokoloka kwa plasma
Kulekerera kwa mbiri ±10 µm
 
Zigawo zimenezi zimakhala ndi kukula kuyambira mamilimita angapo mpaka kupitirira mamita awiri komanso kulemera kuyambira magalamu mpaka matani angapo.

Miyeso Yolondola ndi Metrology

Kulekerera kwachizolowezi mu makina a zida za semiconductor:
mbali
Kulekerera kwanthawi zonse
Njira Yoyesera
Kusalala (pamwamba pa 300 mm)
0.5–2 µm PV
Interferometry (Fizeau, Zygo)
Kufanana
1-5 µm
Magawo amagetsi + interferometry
Malo a dzenje (mabowo zikwizikwi)
±2–5µm
Makina oyezera a Coordinate (CMM)
Pamapeto pake
Ra 0.025-0.1 µm
Interferometry yoyera
Malo ozizira a njira
±10µm
Kuyeza kwa CT kapena ultrasound
 
Makampani otsogola masiku ano nthawi zambiri amakwaniritsa kulondola kwa makina a "sub-micron" kapena "100-nanometer" pazinthu zolemera makilogalamu mazana ambiri.

Kusintha kwa Zida za Makina a CNC pa Ntchito ya Semiconductor

1. Nyengo ya zaka za m'ma 1990 mpaka 2000
Mafakitale akuluakulu oyeretsera magetsi (Waldrich Coburg, Parpas, FPT) okhala ndi mamba a Heidenhain ndi magalasi ambiri. Mabearing a hydrostatic ndi mashawa amafuta ankapereka kukhazikika kwa kutentha.
2. Zaka za m'ma 2010: Magawo a Air-Bearing ndi Magnetic Levitation
Makampani monga Aerotech, Physik Instrumente (PI), ndi ALIO Industries adayambitsa magawo a injini zoyenda ndi mpweya zomwe zimatha kubwerezabwereza pafupifupi 10 nm. Izi zinakhala maziko a malo opangira makina olondola a m'badwo wachiwiri.
3. Mkhalidwe Wapano (2020–2025)
  • Makina a Moore Nanotechnology ndi Precitech single-point diamondi otembenuza zinthu pogwiritsa ntchito magalasi a EUV
  • Malo opangira ma micromachining a Kern Microtechnik ndi Yasda akukwaniritsa kulondola kwa mawonekedwe a 100 nm
  • Mndandanda wa DMG MORI ULTRASONIC wa zoumbaumba
  • Fanuc ROBONANO α-NMiA: 0.1 nm programming resolution ndi 1 nm positioning resolution
  • Masitolo olamulidwa ndi kutentha amasungidwa pa ± 0.01 °C okhala ndi maziko odzipatula ogwedezeka

Mavuto ndi Kusankha Zipangizo

1. Aluminiyamu Aloyi
6061-T6 ndi 5083 ndi mahatchi ogwira ntchito chifukwa cha makina ake abwino komanso yankho lake lodzola. Kudzola kolimba (Mtundu wa III) kumapanga gawo la 25–50 µm Al₂O₃ lomwe limalimbana ndi kuukira kwa plasma. Komabe, ma micropores mu anodizing amatha kugwira tinthu tating'onoting'ono - masitolo amakono amagwiritsa ntchito kutseka kwa masitepe ambiri komanso zokutira zapadera (monga Twin Wire Arc Spray Al₂O₃ kapena Y₂O₃ plasma spray).
2. Zitsulo zosapanga dzimbiri
316L imasankhidwa kuti iteteze dzimbiri ku plasma ya NF₃ ndi Cl₂. Kupukuta ndi electromagnetic ku Ra < 0.2 µm ndikofunikira kuti muchepetse kumatirira kwa tinthu tating'onoting'ono.
3. Zoumba
Alumina (99.8%), aluminiyamu nitride, ndi silicon carbide zimapangidwa mu "mkhalidwe wobiriwira" pogwiritsa ntchito zida za diamondi, kenako zimasiyidwa. Kulekerera pambuyo pa sintering kumachepa ndi 18–22%, zomwe zimafuna mitundu yowonjezereka ya shrinkage.
4. Ma Alloys Otsika a CTE
Invar 36 ndi Super Invar zimagwiritsidwa ntchito mu magawo a EUV ndi DUV lithography komwe kukhazikika kwa nanometer kumafunika pakusintha kwa kutentha kwa 10–40 °C.
5. Zitsulo Zosagwira Ntchito
Molybdenum ndi tungsten zimapangidwa kuti zigwiritsidwe ntchito pa ma electrode otentha kwambiri. Zipangizozi zimakhala zokwawa kwambiri ndipo zimafuna makina olimba okhala ndi choziziritsira champhamvu (70–100 bar).

Njira Zofunikira Zopangira Machining

1. Makina Othamanga Kwambiri (HSM) a Aluminiyamu

SLiwiro la pindle 20,000–42,000 rpm, zida zolinganiza za PCD kapena single-crystal diamondi, kuziziritsa kwa mist, ndi ma algorithms owonera patsogolo amalola kumaliza kofanana ndi galasi (Ra < 4 nm) mu pass imodzi.

2. Kukonza Zida Zopangira Ma Ceramics

Mwa kusunga kuya kwa kudula pansi pa malire ofunikira (nthawi zambiri < 1 µm), zinthu zosweka zimatha kupangidwa munjira yodulira pogwiritsa ntchito zida zakuthwa kwambiri za diamondi, ndikupanga malo abwino kwambiri osasweka.

3. Kutembenuka kwa Daimondi-Point Imodzi (SPDT)
Zofunikira kwambiri pa magalasi a EUV a aspheric. Makina amagwira ntchito m'malo okhala ndi mafuta kapena vacuum okhala ndi yankho la sub-nanometer.
6.4 Waya EDM ndi Sinker EDM
Amagwiritsidwa ntchito poziziritsa kwambiri komanso pazinthu zovuta kuzipanga. Majenereta amakono amakwaniritsa bwino pamwamba pa nthaka < Ra 0.1 µm podula kamodzi kokha.
5. Kupanga Zowonjezera + Zochotsera Zosakaniza Zosakanikirana
Kachitidwe katsopano: mawonekedwe a Invar osindikizidwa ndi 3D kapena titaniyamu pafupi ndi ukonde, kenako makina omalizidwa papulatifomu yomweyo (monga Hermle MPA kapena Lasertec DED hybrids).

Zofunikira za CNC Zolondola Kwambiri ndi Zolondola Kwambiri

Zigawo za semiconductor nthawi zambiri zimafuna:
  • Kulondola kwa malo: ±2–5 µm pa ulendo wa 500–2000 mm
  • Kubwerezabwereza: < 1 µm
  • Kumaliza kwa pamwamba: Ra 0.025–0.1 µm pamalo omwe akuyang'ana plasma
  • Kusalala: 1–3 µm pamwamba pa Ø300–450 mm
  • Kufanana/kukhazikika: < 3 µm
Kuti izi zitheke, malo ogulitsira makina amaika ndalama mu:
  • Malo opangira makina okhala ndi ma axis 5 kapena ngakhale ma axis 8 (monga Yasda, Makino, DMG MORI, Kern, Liechti)
  • Ma spindle opangidwa ndi madzi kapena mpweya omwe amayenda pa liwiro la 20,000–60,000 rpm
  • Makina okhazikika a kutentha amasunga kutentha kwa makina mkati mwa ± 0.1 °C
  • Kufufuza pamakina ndi zida za laser zokhala ndi resolution ya 0.1 µm
  • Maziko a granite kapena polymer-concrete okhala ndi kugwedezeka kogwira ntchito
Chitsanzo: Yasda YBM-950V imatha kukwaniritsa kulondola kwa voliyumu ya 1 µm kuposa 900×500×400 mm chifukwa cha kapangidwe ka bokosi-mu-bokosi ndi masikelo a resolution a 0.05 µm.

Lorem ipsum dolor sit amet, consectetur adipiscing elit. Utulitus, luctus nec ullamcorper mattis, pulvinar dapibus leo.

Advanced Machining Techniques

1. Makina Othamanga Kwambiri (HSM) ndi Zida Zing'onozing'ono
Ma shawa amatha kukhala ndi mabowo 15,000 a Ø0.5 mm obooledwa pa liwiro la 40,000 rpm ndi makina opukutira a 0.1 mm. Kuboola kwa peck pogwiritsa ntchito makina oziziritsira a 100 bar through-tool kumalepheretsa kubwezanso kwa chip.
2. Akupanga-Assisted Machining
Pa zoumbaumba ndi quartz, kugwedezeka kwa ultrasound kwa 20–40 kHz kumachepetsa mphamvu zodulira ndi 30–70%, zomwe zimapangitsa kuti pamwamba pake pakhale bwino komanso kuti chipangizocho chikhale ndi moyo wautali.
3. Kutembenuka kwa Daimondi-Point Imodzi (SPDT)
Amagwiritsidwa ntchito pa magalasi a infrared ndi ma electrode ena amkuwa. Kutha kwa pamwamba mpaka Ra 3–5 nm ndi kofala.
4. Kupukuta kwa 5-Axis Mogwirizana kwa Ma Geometries Ovuta
Ma njira ozizira amkati okhala ndi mainchesi 1 mm ndi chiŵerengero cha 20:1 amapangidwa pogwiritsa ntchito zida zotalika komanso njira zoyendetsera zida za trochoidal.
5. Njira Zophatikiza Zowonjezera ndi Zochotsera
Zigawo zina zatsopano (monga, mitu ya shawa yoziziritsidwa ndi conformal) zimasindikizidwa mu 3D mu Inconel kapena copper kudzera mu DMLS/LaserCusing, kenako zimamalizidwa pamakina omwewo mpaka ±10 µm.

Metrology ndi Chitsimikizo Cha Ubwino

Zigawo za semiconductor zimayesedwa kwambiri mumakampani aliwonse:
  • Zeiss Prismo kapena Leitz PMM-C ma CMM olondola kwambiri okhala ndi kusatsimikizika kwa ±0.3 µm
  • Zygo GPI kapena 4D Technology phase-shifting interferometers kuti zikhale zosalala
  • Ma interferometer oyera a Bruker a malo a Ra < 50 nm
  • Kuyesa kutayikira kwa helium mass-spectrometer kufika pa 10⁻¹⁰ mbar·L/s
  • Kusanthula kwa Mpweya Wotsalira (RGA) pambuyo pa 150 °C kuphika kuti kutsimikizire kutuluka kwa mpweya < 10⁻⁹ Torr·L/s/cm²
  • Kuwerengera tinthu tating'onoting'ono kudzera pa kauntala wa tinthu tating'onoting'ono tamadzimadzi (LPC) kapena chojambulira tinthu ta laser pambuyo poyeretsa ndi ultrasound
Masitolo ambiri tsopano amagwiritsa ntchito njira zoyezera zinthu zomwe zikuchitika mkati mwa dongosolo: Blum laser tool setters, Renishaw OMP400 strain-gauge probes, ndi Marposs acoustic emission sensors kuti azindikire micro-chipping nthawi yomweyo.

Kukonza ndi Kukonza Zipinda Zotsukira

Popeza tinthu tating'onoting'ono toposa 30 nm tingaphe transistor ya 3 nm, masitolo ambiri apamwamba ayika zipinda zoyera za ISO 5 (Class 100) kapena ISO 4 mozungulira makina awo olondola.
 
Zitsanzo zikuphatikizapo:
  • Bullen Ultrasonics (USA)
  • Malo oyeretsera a Tyrolit CNC (Austria)
  • Chipinda chotsukira makina ochapira bwino cha Canon's Utsunomiya (Japan)
Njira zoyeretsera pambuyo pa makina nthawi zambiri zimakhala ndi:
  1. Madzi a DI opanikizika kwambiri + kugwedezeka kwa megasonic
  2. Kuyeretsa mankhwala m'njira zambiri (SC-1, SC-2, piranha)
  3. Kuwumitsa ndi kuuma kwa N₂ koyera kwambiri
  4. Kuphika mu vacuum pa kutentha kwa madigiri 150–200 Celsius
  5. Matumba awiri m'matumba otsukidwa ndi N₂

Phunziro la Nkhani: Kupanga mbale ya EUV Wafer Stage Baseplate

Mbale wamba ya 450 mm EUV wafer stage ikuwonetsa zovuta izi:
  • Zipangizo: SiSiC ceramic, 900 × 800 × 100 mm
  • Kufunika kwa kusalala: < 1 µm PV pamwamba ponse
  • Ma njira 120 ozizira ophatikizidwa, mainchesi 3 mm, malo a ±15 µm
  • Zoyikapo 600 zokhala ndi ulusi (zopepuka za helium ya M4)
  • Malo omaliza: ozungulira mpaka Ra < 50 nm
Kuthamanga kwa njira:
  1. Kupanga kobiriwira kwa chopanda kanthu cholumikizidwa ndi reaction-bonded
  2. Kulowa kwa silicon ndi chithandizo cha kutentha
  3. Kupera koyipa pa malo opangira makina a 5-axis
  4. Kupera kwa Ductile-regime ndi kuya kwa 1 µm kwa kudula
  5. Kumaliza kwa Magnetorheological (MRF) pokonza mawonekedwe omaliza
  6. Metrology pa Zygo VeriFire MST 600 mm aperture interferometer
  7. Kugundana komaliza ndi dzanja ngati pakufunika
Nthawi yonse yopangira makina: Masabata 6–10 pa gawo lililonse. Mtengo: $800,000–$1.2 miliyoni.

Mavuto Pamene Makampani Akusamukira ku Sub-2 nm Nodes

1. Kukhazikika kwa Angstrom-Level
Zida zamtsogolo za EUV high-NA zidzafunika kukhazikika pa malo oimikapo siteji pakati pa 50–100 picometer. Izi zimakankhira zigawo zamakina ku malire oyambira a zinthu.
2. 450 mm Kusintha
Ma wafer akuluakulu amafuna zida zazikulu zopangidwa ndi makina zomwe zili ndi kulondola kofanana—kuwonjezeka kwakukulu kwa zovuta.
3. Zipangizo Zatsopano
Zipangizo zopangidwa ndi kaboni (zophimba za graphene, kaboni wonga diamondi), zinthu zopangidwa ndi chitsulo-matrix, ndi kapangidwe ka photonic zidzafunika njira zatsopano zogwirira ntchito.
4. Kukhazikika
Makampaniwa ali pamavuto kuti achepetse kugwiritsa ntchito mphamvu, madzi, ndi mankhwala. Makampani opanga makina akugwiritsa ntchito mafuta ochepetsa kuchuluka (MQL), kuziziritsa kwa cryogenic, ndi kubwezeretsanso ma chips a aluminiyamu.

Kutsiliza

Ngakhale nkhani za semiconductor zikupitirirabe pa kutalika kwa lithography ndi kuchuluka kwa transistor, zoona zake n'zakuti palibe chip yotsogola yomwe ingapangidwe popanda gulu la zida zamakono zolondola kwambiri zopangidwa ndi CNC machining. Kuyambira zipinda zotsukira za matani ambiri mpaka micron mpaka magawo a ceramic wafer okhazikika mpaka maatomu ochepa, CNC machining imagwira ntchito pamalire a zomwe zingatheke mwamakina.
 
Pamene makampani akuthamanga kuti apeze zinthu za angstrom-scale ndi ma wafer a 450 mm, kufunikira kwa makina olondola kudzawonjezeka. Masitolo omwe angathe kupereka kulondola kwa sub-micron pazinthu za mita, muzinthu zachilendo, m'malo oyeretsera, adzakhalabe ogwirizana ndi ASML, Applied Materials, Lam Research, Tokyo Electron, ndi opanga ma chip okha.
 
Pomaliza pake, lamulo lodziwika bwino la Moore si nkhani ya sayansi ya fizikisi ndi chemistry chabe—komanso ndi kupambana kwa uinjiniya wamakina komwe kunakwaniritsa gawo limodzi lopangidwa bwino nthawi imodzi.